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SiliconAuto Taiwan CO., LTD.

Hsinchu City,  Taiwan
https://www.siliconautotech.com/
  • Booth: T9116

Overview

SiliconAuto is a fabless semiconductor company focused on everything that moves—cars, trucks, two-wheelers, robots and drones.


Founded in 2023, SiliconAuto was created to simplify automotive electronics as vehicles shift toward electric, autonomous, and software-defined platforms. Backed by Foxconn and Stellantis, we exist to meet this change with unwavering intent. We provide a path into the world’s most advanced semiconductor ecosystem through a growing portfolio of automotive-grade products paired with solutions to simplify integration and help teams accelerate next-generation vehicles to market. As automotive converges with autonomy, vehicles are evolving into agents of physical AI, becoming more intelligent, connected, and embedded in everyday life. We design chips to support this shift, enabling innovation and expanding human potential.


  Press Releases

  • 現場展出智慧機器人與自動駕駛半導體解決方案,邀請客戶與產業夥伴蒞臨台北南港展覽二館七樓T9116攤位體驗


    台北訊,2026年9月1日- 鴻軒科技(SiliconAuto)將於 SEMICON Taiwan 2026 T9116 攤位展示其應用於 Physical AI 的車規級晶片解決方案,並展現透過台灣世界領先半導體產業生態系協作所打造的技術成果。參觀者可於現場體驗多項展示,了解相關技術如何支援未來機器人與自動駕駛應用。該系列解決方案以 XMotiv™ M3 微控制器(MCU)及高效能運算(HPC)平台為基礎,應用於智慧車輛與機器人。

    展覽期間,鴻軒科技團隊也將在攤位現場分享對於Physical AI發展觀點,內容涵蓋半導體架構設計、系統開發,以及多晶片整合與封裝等關鍵議題。參觀者亦可親自體驗 XMotiv™ M3 開發套件,了解其於機器人控制器、汽車車身控制及安全協調控制等應用場景的開發成果。

    專為安全可靠Physical AI打造的車規級半導體技術

    鴻軒科技本次將透過三項展示,呈現其在機器人、自動駕駛以及新世代AI運算領域的技術成果:

    • XMotiv™ M3作為ASIL-B等級機器人控制器
      • 鴻軒科技攜手專注於推動 AI 機器人落地應用的台灣機器人開發商 Nexuni,首次展示四足巡檢機器人運動控制板參考設計,由XMotiv™ M3負責關節驅動與動態平衡控制。此展示呈現 XMotiv™ M3 的高速介面能力,可支援即時通訊與控制,並透過符合 ASIL-B 功能安全等級的設計,為Physical AI 應用奠定安全性與資安防護的基礎。

    • 將XMotiv™ M3應用於自動駕駛系統
      • 現場將展示MCU XMotiv™ M3如何搭配ZF車用HPC平台I/O介面晶片,支援最高Level 4自動駕駛應用。此方案首度於歐洲Embedded World 2026亮相,並榮獲Embedded Award「SoC / IP / IC Design」類別大獎。展示內容將呈現XMotiv™ M3在系統管理、安全監控與資安防護等功能上的應用。

    • 車用與機器人HPC Chiplet平台
      • 鴻軒科技也將搶先展示下一代 Physical AI 推論解決方案,採用符合車規等級的高效能運算(HPC)Chiplet 架構,滿足未來自駕車與先進機器人平台對高效能運算的嚴苛需求。此次展示透過 SiliconPilot™ 數位孿生(Digital Twin)平台模擬運行,提供晶片量產前的驗證與開發模型。

    隨著Physical AI加速推動自駕車與智慧機器人的發展,鴻軒科技正協助客戶串接AI決策能力與實體世界的即時控制需求。透過車規級晶片解決方案,微控制器(MCU)、高效能運算(HPC)、車連網技術應用於汽車與機器人等智慧移動載具,以及台灣領先全球的半導體生態系資源,鴻軒科技致力於推動下一代安全可靠的Physical AI 系統發展。


    關於鴻軒科技(SiliconAuto)

    鴻軒科技是一家專注於各類移動載具應用的 IC 設計公司,產品應用涵蓋汽車、機車、機器人及無人機。公司由鴻海科技集團與Stellantis於2023年共同成立,致力於在電動化、自動駕駛與軟體定義車輛(SDV)浪潮下,簡化汽車電子系統開發流程。目前,鴻軒科技透過持續擴展的車規級晶片產品組合、參考設計與系統級解決方案,協助客戶更有效率地運用全球最先進的半導體供應鏈,加速新世代產品上市。憑藉在功能安全、硬體資安與低延遲運算方面的深厚技術基礎,鴻軒科技正將成熟的車用半導體技術延伸至新興Physical AI應用領域,協助客戶開發更安全、更具資安防護能力的智慧系統。

    https://www.siliconautotech.com/zh-tw

    獲獎與技術肯定

    於歐洲Embedded World 2026展會中,鴻軒科技與ZF合作展示的MCU XMotiv™ M3 ADAS伴隨控制器(Companion Controller)解決方案,榮獲Embedded Award「SoC / IP / IC Design」類別獎項肯定。此獎項彰顯鴻軒科技在半導體創新設計方面的技術實力,以及與全球一級汽車供應商合作推動自動駕駛技術發展的成果。 

    https://www.embedded-world.de/en/press/press-releases/2026/03/embedded-award-2026-products-honoured

    關於ZF(採埃孚)

    ZF是一家活躍於全球的技術集團。該公司為乘用車、商用車和工業技術的移動性提供高度開發的產品和系統。憑藉全面的產品系列,ZF主要為汽車製造商、交通供應商和運輸和交通領域的新興公司提供服務。ZF能為各種車型提供電力驅動解決方案。憑藉其產品組合,ZF始終致力於推動節能減排、環境保護以及出行的安全性。除了乘用車和商用車領域以外,ZF還服務於建築和農業機械、風力發電、運輸、鐵路技術和測試系統等細分市場。 

    https://press.zf.com/press/en/releases/release_100548.html

    關於Nexuni

    Nexuni 耐思尼股份有限公司成立於台灣新竹科學園區,致力於打造真正能落地應用的 AI 機器人。憑藉自主研發的 AI 平台與完整機器人技術堆疊,Nexuni 整合感知、控制、定位與決策能力,讓機器人能夠學習、適應並穩定運行於真實場域。其解決方案專為面臨缺工及高風險作業環境的產業打造,涵蓋焊接、安保、清潔、停車管理及餐飲服務等應用領域,提供可擴充且高度客製化的機器人自動化方案。

    https://www.nexuni.com/zh-tw/

  • Industry partners are invited to visit Booth T9116, Level 7, TaiNEX Hall 2 for live demonstrations of robotics and autonomous driving semiconductor solutions


    Taipei, Taiwan – September 1, 2026 – At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications. The solutions are built on the XMotiv™ M3 microcontroller and high-performance computing (HPC) platforms used in intelligent vehicles and robots.

    Throughout the exhibition, the SiliconAuto team will be on hand to discuss practical approaches to Physical AI development. Topics range from semiconductor architecture and system design to multi-die integration and packaging. Visitors can also get hands-on with XMotiv™ M3 developer kits for robotic motion control, automotive body control, and safety orchestration.


    Automotive-Grade Silicon, Purpose-Built for Safe and Secure Physical AI

    Experience SiliconAuto technologies in action through three demonstrations, spanning robotics, autonomous driving, and high-performance computing:

    • XMotiv™ M3 as an ASIL-B Robotics Controller
      • In collaboration with Nexuni, a Taiwanese robotics developer focused on bringing AI-powered robots into practical, everyday applications, SiliconAuto is debuting a robotic motion control developer kit. XMotiv™ M3 controls dynamic stabilization through joint actuators. The demonstration highlights XMotiv™ M3's high-speed interface capabilities. These capabilities enable real-time control. ASIL-B compliance lays the safety and security foundation.

    • XMotiv™ M3 for Autonomous Driving
      • See how MCU XMotiv™ M3 works alongside ZF's I/O interface chip to support autonomous driving capabilities up to Level 4. This autonomous driving solution was first unveiled at Embedded World 2026 where it received the Embedded Award in the SoC/IP/IC Design category. The solution demonstrates XMotiv™ M3 performing safety orchestration, including system management and security functions.

    • Automotive and Robotics Multi-Chiplet System
      • Get an exclusive preview of SiliconAuto's next-generation Physical AI inference solution. The solution is built on an automotive-grade high-performance computing (HPC) chiplet architecture, designed to meet the demanding requirements of future autonomous vehicles and advanced robotics platforms. The demonstration is powered by the SiliconPilot™ digital twin, which provides a pre-silicon model for validation and development.

    As Physical AI drives the emergence of autonomous vehicles and robots, SiliconAuto is helping customers bridge the gap between AI thinking and physical action. Through automotive-grade silicon solutions, built on XMotiv™ M3 microcontroller, high-performance computing (HPC) platforms, vehicle-to-everything connectivity solutions, and collaboration across Taiwan's world-leading semiconductor ecosystem, the company is enabling the next generation of safe and secure Physical AI systems.


    About SiliconAuto

    SiliconAuto is a fabless semiconductor company focused on everything that moves—applications including cars, trucks, two-wheelers, robots, and drones. Hon Hai Technology Group (“Foxconn”) and Stellantis founded the company in 2023 with a mission to simplify automotive electronics as vehicles evolve into electric, autonomous, and software-defined platforms. Today, the company provides a direct path into the world’s most advanced semiconductor ecosystem through a growing portfolio of automotive-grade chips, combined with reference designs and system-level solutions that help streamline integration and enable teams to accelerate next-generation products to market. Building on its expertise in functional safety, hardware security, and low-latency computing, SiliconAuto is bringing proven automotive semiconductor technologies to emerging Physical AI applications, enabling customers to develop safe and secure systems for the future. 

    https://www.siliconautotech.com/

    Awards & Recognition

    At the Embedded World 2026 exhibition in Germany, SiliconAuto and ZF won the Embedded Award in the SoC/IP/IC Design category with an autonomous driving solution that features SiliconAuto’s XMotiv™ M3. The award reflects SiliconAuto's expertise in developing innovative semiconductor solutions and its successful collaboration with a leading Tier 1 automotive supplier to advance the autonomous driving technology that underpins the Physical AI era.

    https://www.embedded-world.de/en/press/press-releases/2026/03/embedded-award-2026-products-honoured

    About ZF

    ZF is a global technology company supplying advanced mobility products and systems for passenger cars, commercial vehicles and industrial technology. Its comprehensive product range is primarily aimed at vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility. ZF electrifies a wide range of vehicle types. With its products, the company contributes to reducing emissions, protecting the climate as well as enhancing safe mobility. Alongside the automotive sector – passenger cars and commercial vehicles – ZF also serves market segments such as construction and agricultural machinery, wind power, marine propulsion, rail drives and test systems.

    https://press.zf.com/press/en/releases/release_100548.html

    About Nexuni

    Nexuni Co., Ltd., founded in Taiwan's Hsinchu Science Park, develops AI-powered robots built for real-world deployment. Leveraging its proprietary AI platform and complete robotics technology stack, Nexuni integrates perception, control, localization, and decision-making capabilities to enable robots to learn, adapt, and operate reliably in real-world environments. The company provides scalable and customizable robotic automation solutions for industries facing labor shortages and high-risk working conditions, including welding, security, cleaning, parking management, and food service.

    https://www.nexuni.com/en/


  Products

  • XMotiv™ M3
    XMotiv™ M3 is a secure MCU designed to meet the requirements for functional safety, cybersecurity, and real-time control in automotive and robotics....

  • XMotiv™ M3 is a secure MCU designed to meet the requirements for functional safety, cybersecurity, and real-time control in automotive and robotics. Built on the Arm Cortex-M33 core, XMotiv™ M3 provides a robust and scalable control platform for safety-critical embedded systems, well-suited for body control modules and robotic control nodes.

    • 160 MHz Arm Cortex-M33 Core: Efficient, deterministic compute for real-time automotive control, enabling smooth actuation, fast response, and reliable subsystem behavior.
    • Extensive Peripheral Interface: Flexible, scalable connectivity for vehicle networks, making integration with distributed ECUs and smart actuators faster and more predictable.
    • Advanced Safety & Security: Protects critical vehicle functions with built-in safety mechanisms and hardware-level security that reduce risk and support ISO 26262 compliance.
  • SiliconPilot™
    SiliconPilot™ streamlines the creation of next‑generation vehicles and robots by enabling developers to model, test, and validate hardware-software systems entirely in a virtual environment....

  • SiliconPilot™ streamlines the creation of next‑generation vehicles and robots by enabling developers to model, test, and validate hardware-software systems entirely in a virtual environment. Automakers and robotics teams can explore future designs, uncover issues early, and refine performance before committing to silicon—reducing risk, accelerating schedules, and clearing a faster path to breakthrough innovation.

    • Shorten the Development Cycle: Model, test, and validate hardware–software systems through a high‑fidelity digital twin. Reduce iteration time, catch issues earlier, and accelerate your path to production‑ready silicon.
    • Accelerate Architecture Exploration: Rapidly explore design options in a virtual environment. Evaluate trade‑offs, optimize performance, and de‑risk decisions long before committing to physical silicon.
    • Leapfrog into New Markets: Build on a scalable, modular platform that spans automotive, robotics, drones, and emerging autonomy systems—empowering teams to expand product lines and enter new categories faster.
  • AI Accelerator
    Transform awareness into understanding with scalable high-performance computing that unlocks efficient, optimized physical AI for the real world....

  • As physical AI workloads grow, the challenge shifts from peak compute to balancing performance within power, thermal, and cost constraints. Developers need high-performance compute solutions that optimize these trade-offs, delivering right-sized performance for real-world edge AI deployments across automotive, robotics, drones, and beyond.

    • Inference-Optimized Architecture: Purpose-built to accelerate AI inference workloads, delivering fast, efficient execution of trained models while balancing performance, power, and thermal efficiency.
    • Ultra-Low Latency Performance: Enables real-time AI processing with minimal delay, ideal for time-sensitive applications such as object avoidance in autonomous driving and advanced robotic platforms.
    • High Performance per Watt: Optimizes compute efficiency to maximize AI performance while minimizing power consumption in physical AI deployments such as autonomous vehicles and robots.

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