Overview
MetaSOL — light-based process solutions for advanced semiconductor packaging and glass substrates.
By replacing conventional thermal, laser, and chemical methods with controlled Intense Pulsed Light (IPL) flashes, MetaSOL delivers faster, low-temperature, minimal-damage manufacturing.
IPL Photonic Debonding
Full-area, non-scanning irradiation across the entire wafer — zero-stress release with high throughput. Core material: Meta-IAL™ absorption layer.
TGV / Copper Metallization
IPL sintering completes copper paste metallization in seconds — versus tens of minutes for conventional thermal ovens — while preventing substrate deformation.
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