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EV Group Inc.

Tempe,  AZ 
United States
https://www.EVGroup.com
  • Booth: 5751

Visit us at booth #5751 at SEMICON West 2025!

Overview

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

  Press Releases

  • ST. FLORIAN, Austria, May 26, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications. 

    With a new dual-stage design, up to six exposure units, a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a five-fold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

    Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration

    Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

    EVG MLE Technology Advantages

    LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

    • Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure process
    • High-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitations
    • Simple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masks
    • Real-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughput
    • Supports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

    According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

    Automotive, Security and Imaging Benefits from EVG MLE Technology

    In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

    Product Availability

    EVG is now accepting orders for the LITHOSCALE XT maskless exposure system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/lithography/lithoscale-maskless-exposure-lithography-systems/lithoscale-xt

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  • EVG achieves Five Star rating across all participating award categories, including first-place finishes in “Global Semiconductor Supplier” segments, lithography equipment, and specialty fab equipment

    ST. FLORIAN, Austria, June 26, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that it has once again topped the rankings in the 2025 TechInsights Semiconductor Supplier Awards. EVG was voted by customers as one of the Top 10 Customer Service Focused Suppliers of Chip Making Equipment and one of the Top Suppliers of Fab Equipment and WFE to Specialty Chip Makers. In addition, EVG achieved a Five Star rating across all participating award categories, including first place finishes (now dubbed Global #1) in Fab Equipment, WFE to Specialty Chip Makers, Lithography Equipment, and Specialty Fab Equipment (for wafer bonding). 

    As a result, once again, EVG received awards for three major customer satisfaction award groups, marking the 13th year in a row that it has achieved this feat.

    According to TechInsights, customers rated EVG best at partnering, technical leadership, recommended supplier, commitment, trust in supplier, and quality of results. In total, EVG was recognized by customers in the following award categories:

    • Global Semiconductor Supplier Awards – Top 10 Customer Service – Focused Suppliers of Chip Making Equipment
    • Global Semiconductor Supplier Awards – Fab Equipment
    • Global Semiconductor Supplier Awards – WFE to Specialty Chip Makers
    • Global #1 in Fab Equipment
    • Global #1 in WFE to Specialty Chip Makers
    • Global #1 in Lithography Equipment
    • Global #1 in Specialty Fab Equipment 

    A white paper detailing EVG’s survey results issued by TechInsights is available here.

    According to G. Dan Hutcheson, vice chair of TechInsights, “This year, EV Group reached thirteen consecutive Triple Crown Wins in the TechInsights Global Semiconductor Supplier Awards, which is a tremendous achievement. EV Group is highly trusted and recommended by customers, and was recognized for its strong partnering efforts, earning the highest score among all Top 10 Customer Service – Focused Suppliers in partnering. More than scores, customers participating in the survey wrote in: ‘Very supportive and knowledgeable technical sales and support people,’ ‘Solid technical team providing innovative solutions to complex integration problems’ and ‘Excellent knowledge ranging from tooling requirements to processing and market needs.’ These comments demonstrate how EVG’s focused process knowledge is key to developing core capabilities of wafer bonding, lithography, and metrology for its customers.”

    “We are deeply grateful to our customers for once again recognizing EV Group in the 2025 TechInsights Customer Satisfaction Survey,” stated Hermann Waltl, executive sales and customer support director at EV Group. “Achieving a Five Star rating across all participating award categories—and earning the top spot in both lithography and specialty fab equipment for a second year in a row—is a tremendous honor. This year’s results build on our already strong track record and reflect the continued investments we’ve made in customer service, support and technical collaboration. We remain committed to helping our customers succeed and are proud to be seen as a trusted partner as they advance the frontiers of semiconductor technology.”

    EVG offers a complete portfolio of wafer-level, high-volume-manufacturing solutions for a wide variety of micro- and nanotechnology applications and products, addressing established as well as emerging markets. The company’s field-proven equipment, combined with EVG’s superior process expertise and development support, enable its global customer base to stay one step ahead of the competition.

    About TechInsights

    Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights’ content informs decision makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future. Over 650 companies and 100,000 users access the TechInsights Platform, the world’s largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary. TechInsights’ customers include the most successful technology companies who rely on TechInsights’ analysis to make informed business, design, and product decisions faster and with greater confidence. For more information, visit www.techinsights.com.

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  • EVG celebrates 30th anniversary of its North America subsidiary in Arizona

    ST. FLORIAN, Austria, September 30, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced that it is highlighting the latest developments in hybrid bonding, maskless lithography, metrology and nanometer-precision layer transfer technology at SEMICON West, the premier microelectronics exhibition in North America, to be held next week on October 7-9 in Phoenix, Ariz. 

    EVG also announces that it is celebrating the 30th anniversary of its fully owned North America subsidiary, based in Arizona, a milestone that coincides with SEMI’s inaugural SEMICON West show in Phoenix. At the event, EVG will highlight its efforts to support onshoring and local innovation in Arizona and throughout North America.

    Enabling Semiconductor Scaling with Hybrid Bonding Solutions
    At SEMICON West, EV Group will provide technology and market updates on its industry-leading suite of wafer-to-wafer and die-to-wafer hybrid bonding solutions, including the new EVG®40 D2W—the first dedicated metrology system that enables 100 percent die overlay measurement at high throughput. Designed for chiplet integration, high-bandwidth memory (HBM) stacks, and other advanced 3D packaging applications, the EVG40 D2W helps improve process control and yield in high-volume manufacturing. Executives will be available to discuss the new system, as well as other industry developments in chiplet integration and hybrid bonding.

    Meeting Lithography Needs for Heterogeneous Integration
    EVG’s new LITHOSCALE® XT brings true high-throughput, high-resolution digital lithography to heterogeneous integration. This next-generation maskless exposure system achieves up to 5X higher throughput than previous solutions, with stitch-free full-wafer patterning and real-time die-shift compensation. LITHOSCALE XT is optimized for AI/HPC interposers, panel-level packaging, and advanced sensor production, as well as die traceability for security and automotive applications. At SEMICON West, executives will be available to discuss LITHOSCALE XT and how digital lithography enables advances in AI, high-performance computing (HPC), and advanced packaging.

    Celebrating 30+ Years in Arizona Region
    With more than 30 years of operations in the greater Phoenix region, EVG plays a vital role in supporting the growth of U.S. semiconductor manufacturing and advanced packaging. EVG is well positioned to serve regional customers across semiconductors, optics, MEMS, and sensors—supporting key markets like AI and cloud computing, telecom, automotive, and healthcare. 

    “For three decades, EVG North America has played a key role in supporting our customers as we’ve advanced the semiconductor industry roadmap with our fusion and hybrid bonding, lithography, and metrology process solutions,” stated Hermann Waltl, executive sales and customer support director as well as member of the executive board at EVG. “With the rapid growth of semiconductor manufacturing and packaging in Arizona and across the U.S., our local team continues to provide the process expertise and close collaboration that EVG is known for worldwide. It is exciting to be back at SEMICON West—now in Phoenix—to showcase how we are enabling the next wave of semiconductor scaling and integration.”

    See EVG at SEMICON West 2025
    SEMICON West attendees interested in learning more about EVG and its suite of wafer bonding, lithography and metrology solutions supporting AI, telecom, automotive, health care and other industries, are invited to visit EVG at Booth #5751 in Hall 1 (Lower Level) on October 7-9 at the Phoenix Convention Center in Phoenix, Ariz. 

    EVG is also a proud sponsor of the Canyon on 3rd and SEMICON West’ern experience, located between the North and West Halls of the Phoenix Convention Center. On Tuesday evening, October 7, show attendees can stop by the Bourbon Ranch to unwind with EVG and sample top-shelf bourbons and whiskeys.

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  Products

  • LITHOSCALE® XT
    EVG's LITHOSCALE® XT maskless exposure (MLE™) system is the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications....

    • ST. FLORIAN, Austria, May 26, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications. 

    With a new dual-stage design, up to six exposure units, a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a five-fold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

    Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration

    Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

    EVG MLE Technology Advantages

    LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

    • Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure process
    • High-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitations
    • Simple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masks
    • Real-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughput
    • Supports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

    According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

    Automotive, Security and Imaging Benefits from EVG MLE Technology

    In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  • Next-Generation GEMINI® Automated Production Wafer
    Platform incorporates newly designed high-force bond chamber that ensures excellent bond quality and yield across larger wafer surfaces...

    • ST. FLORIAN, Austria, March 18, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers. Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent bond quality and yield for MEMS devices built on larger wafers. EVG has already delivered several GEMINI systems built on the new equipment platform to multiple leading MEMS manufacturers.

    According to Yole Group, the MEMS market is set to grow from US$14.6 billion in 2023 to US$20 billion in 2029 (1). This growth is largely driven by inertial sensors, microphones, and new generations of MEMS, including microspeakers, which are increasingly used in smartwatches, True Wireless Stereo (TWS) earbuds, and other consumer wearable devices. Many MEMS devices need to be protected from the external environment or can operate only under controlled atmosphere or vacuum. Metal-based wafer bonding (Eutectic, Transient-Liquid-Phase and Thermo-compression) plays an essential role in the manufacture of these MEMS devices by enabling hermetic sealing and pressure or vacuum encapsulation. 

    MEMS manufacturers have begun to transition from 200-mm to 300-mm production lines to achieve economies of scale and meet growing market demand for MEMS devices, as well as to support new device integration schemes such as CMOS-MEMS integration, and the production of MEMS devices with larger footprint, such as ultrasonic MEMS and micromirrors. However, migrating to 300-mm wafers requires significantly higher bond forces compared to 200-mm wafers to ensure the same bond pressure over a much larger surface area.

    EVG’s next-generation GEMINI system for 300-mm wafers exceeds the specifications required for 300-mm MEMS manufacturing – meeting the needs of both current and future MEMS device generations. An integrated modular HVM system for aligned wafer bonding, the GEMINI platform features up to four bond chambers with adjustable bond force (up to 350 kN), high vacuum (down to 5 x 10-6 mbar) and overpressure capability (2000 mbar abs.). It also maintains the industry-leading capabilities of the previous-generation platform, including fully automated optical alignment, full flexibility with customizable module configurations and support for a wide range of bonding processes. 

    “EVG has more than 30 years of experience providing production wafer bonding systems for the MEMS industry. Working closely with our customers and partners, we can see key trends and inflection points in this market very early on, and plan accordingly,” stated Dr. Thomas Glinsner, corporate technology director at EV Group. “Our next-generation GEMINI wafer bonding system is a prime example of EVG putting our long-term vision and experience into action. The result is the first wafer bonder of its kind for the MEMS industry, which helps our customers to stay on their technology roadmaps and bring innovative and exciting new MEMS devices and end-products to market.”

    Product Availability

    EVG is now accepting orders for the next-generation GEMINI automated production wafer bonding system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/bonding/permanent-bonding-systems/gemini

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  • EVG®40 D2W
    New EVG®40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark....

    • EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration

    New EVG®40 D2W overlay metrology system provides 100 percent overlay measurement on every die at up to 15X higher throughput versus industry benchmark

    ST. FLORIAN, Austria, September 8, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).

    The EVG40 D2W can be used for any D2W bonding application, including chiplet integration, high-bandwidth memory (HBM) stacks, and 3D system on chip (SoC) integration processes, which enable high-performance devices for artificial intelligence (AI), high-performance computing (HPC), data centers and other applications. Multiple EVG40 D2W systems have already been installed at customer sites and are being used in HVM production services.

    EVG executives will be available to discuss the EVG40 D2W system, as well as industry developments in chiplet integration, hybrid bonding and other important updates at SEMICON Taiwan, taking place this week in Taipei, Taiwan, September 8-12.

    D2W Bonding Enables High-Performance Devices

    D2W bonding integrates diverse dies or chiplets of different sizes, materials, and functions into a single device or package. This is essential for creating devices and systems that meet the increased performance demands of applications like AI and autonomous driving, with lower power consumption. As interconnect pitches in 3D packaging become tighter with each new product generation, die bond alignment and overlay processes must also scale accordingly, not only with greater accuracy but also higher measurement coverage, to identify overlay errors that can lead to misaligned copper pads or bond interfaces and result in yield loss.

    Legacy Overlay Metrology Methods Ill-Matched for D2W Bonding

    Current D2W bond overlay metrology systems utilize “move-acquire-measure” techniques inherited from wafer-to-wafer (W2W) bond overlay metrology systems, which exceed the measurement precision while lacking the throughput necessary for D2W bond overlay metrology. To achieve faster run rates, these systems must reduce sampling sizes, resulting in sparse alignment information that can lead to inaccurate feedback for process correction. At the same time, integrated metrology solutions in pick and place D2W bonding systems are less flexible and do not have sufficient accuracy for leading-edge applications.

    Dedicated D2W Overlay Metrology with EVG40 D2W

    The EVG40 D2W has several hardware and software enhancements to achieve precise 100 percent overlay measurements across all dies on a 300-mm wafer without impacting throughput:

    • Enhanced throughput via dual-layer measurement of alignment targets on both the die and the base wafer in a single pass
    • High-speed precision from a new stage design, which ensures synchronization between image capture and stage movement
    • Consistent accuracy thanks to a modified light source, which maintains proper levels of illumination for precise measurements
    • High-quality image capture enabled by large focal offset, ensuring high signal-to-noise ratio when the focal plane of alignment targets differs between base and top chiplets

    According to Paul Lindner, executive technology director at EV Group, “As a leader in hybrid bonding,
    EV Group is steadfast in its commitment to developing new products and capabilities that push the performance envelope and solve our customers’ most complex integration problems. The die-to-wafer bonding process is particularly challenging since the integration of different types of chips, nodes and materials requires comprehensive metrology in production environments to better understand and improve the bonding process without sacrificing throughput. We are therefore pleased to introduce the EVG40 D2W, the newest addition to our portfolio of D2W bonding solutions. Designed from the ground up as a dedicated D2W metrology tool, the EVG40 D2W delivers the highest throughput of any system in its class. We look forward to working closely with our customers and partners to leverage this new D2W bonding solution to optimize their hybrid bonding processes for their latest products.”

    EVG40 D2W Key Features and Benefits

    • Measures up to 2800 overlay measurement points across the wafer in just four minutes, delivering 100 percent die positioning feedback without sacrificing throughput
    • Measurement precision supports requirements for leading-edge D2W bonding applications
    • Uses an advanced model to calculate placement, distortion, rotation and run-out variation for each die
    • Feeds measurement results back to the fab’s host system for analysis, enabling optimization of D2W overlay and bonding process for future wafer runs
    • Can be used alongside any third-party D2W bonding system to ensure the highest possible level of quality control
    • Complements EVG’s suite of tools for D2W bonding, including the EVG320 D2W activation and cleaning system

    Product Availability

    EVG is now accepting orders for the EVG40 D2W automated die-to-wafer overlay metrology system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/metrology/evg40-d2w.

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