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EV Group Inc.

Tempe,  AZ 
United States
https://www.EVGroup.com
  • Booth: 5751

Visit us at booth #1345 at SEMICON West 2024!

Overview

About EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.

  Press Releases

  • ST. FLORIAN, Austria, May 26, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications. 

    With a new dual-stage design, up to six exposure units, a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a five-fold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

    Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration

    Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

    EVG MLE Technology Advantages

    LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

    • Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure process
    • High-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitations
    • Simple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masks
    • Real-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughput
    • Supports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

    According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

    Automotive, Security and Imaging Benefits from EVG MLE Technology

    In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

    Product Availability

    EVG is now accepting orders for the LITHOSCALE XT maskless exposure system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/lithography/lithoscale-maskless-exposure-lithography-systems/lithoscale-xt

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  Products

  • LITHOSCALE® XT
    EVG's LITHOSCALE® XT maskless exposure (MLE™) system is the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications....

    • ST. FLORIAN, Austria, May 26, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today introduced the LITHOSCALE® XT maskless exposure (MLE™) system, the industry’s first true high-throughput/high-resolution digital lithography solution for high-volume-manufacturing (HVM) heterogeneous integration applications. 

    With a new dual-stage design, up to six exposure units, a dual-wavelength direct laser source as well as additional hardware and software enhancements, the LITHOSCALE XT offers up to a five-fold increase in throughput compared to EVG’s current-generation LITHOSCALE solution, which previously was the highest-throughput maskless lithography system at comparable resolution. The LITHOSCALE XT is ideally suited for applications involving multi-die patterning, fan-out wafer-level packaging (FoWLP) for AI and high-performance computing (HPC) devices, panel-level packaging, MEMS, advanced imaging sensors, and die traceability for security and automotive applications.

    Maskless Exposure Technology – Ideal Patterning Solution for Heterogeneous Integration

    Heterogeneous integration—the manufacturing, vertical assembly and packaging of multiple different dies into a single package—has led to greater package complexity, as well as a greater number of package options available. This in turn is driving the need for greater design flexibility and the ability to adopt both die-level and wafer-level designs simultaneously in back-end lithography. Accurate reconstitution of wafers is a key parameter in integrating dies from various wafer fabs or fab lines in multi-die solutions. Steppers and other mask-based patterning systems struggle to cope with inaccuracies from die-placement and die-shift variations caused by over-molding. In addition, the reticle size and optics dimensions of static exposure systems limit the exposure area. This is particularly challenging in large die interposer fabrications, where stitch-lines and/or mismatches overlap regions of the reticle exposure field, which can affect the electrical properties within the redistribution layer (RDL). The ability to generate a homogenous pattern for interposers that exceed current reticle size is crucial for devices with complex designs, such as those used in advanced graphic processing, 5G, AI and HPC.

    EVG MLE Technology Advantages

    LITHOSCALE XT tackles legacy bottlenecks associated with steppers by combining powerful digital processing that enables real-time data transfer and immediate exposure, with high structuring resolution and high throughput. Key features include:

    • Up to six exposure heads to cover a 300-mm wafer or 300-mm x 300-mm panel substrate in a parallel exposure process
    • High-resolution (down to sub-2-micron lines/spaces), stitch-free, full-wafer patterning with no field-exposure or die-size limitations
    • Simple switching between mask layouts, supporting multi-die patterning without the associated high cost of ownership for having many masks
    • Real-time wafer-level distortion and die-shift compensation for bowed or warped wafers, enabling improved die-placement accuracy and patterning yield without impact on throughput
    • Supports a wide range of exposure applications thanks to a dual-wavelength laser source (e.g., thin and thick photoresists, <1 micron up to >100 microns in thickness, chemically amplified resists, positive and negative tone, dielectrics, high-aspect-ratio patterning, etc.)

    According to Dr. Bernhard Thallner, pathfinding and optics director at EV Group, “The adoption and evolution of heterogeneous integration is driving tighter performance requirements for back-end lithography that can no longer be fully met with traditional mask-based solutions like steppers and mask aligners. While the technical advantages of MLE technology are abundantly clear, throughput has been a barrier to HVM adoption until now. Our newest MLE platform, LITHOSCALE XT, supports our customers’ unique patterning needs in HVM, not only for advanced packaging but also numerous other applications that can benefit from its combination of high versatility, resolution and throughput. We are ready to engage with customers and partners to help them leverage the myriad benefits of our MLE technology for their respective unique manufacturing needs.”

    Automotive, Security and Imaging Benefits from EVG MLE Technology

    In addition to advanced packaging, LITHOSCALE XT is also ideal for use in the manufacture of advanced image sensors—which involve complex shapes and highly functional optical materials that present challenges to stepper technologies—thanks to its high resolution and excellent sidewall profile performance on structures with complex shapes and/or high aspect ratios. LITHOSCALE XT’s Dynamic Die Annotation capability also enables on-the-fly generation of unique die identifiers for each individual wafer, supporting industry standards for individual die identification and traceability—such as SEMI E142 and SEMI T23—that are designed to meet the needs of the highly demanding security and automotive markets.

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

  • Next-Generation GEMINI® Automated Production Wafer
    Platform incorporates newly designed high-force bond chamber that ensures excellent bond quality and yield across larger wafer surfaces...

    • ST. FLORIAN, Austria, March 18, 2025—EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the next-generation version of its GEMINI® automated production wafer bonding system for 300-mm wafers. Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform includes a newly designed high-force bond chamber that ensures excellent bond quality and yield for MEMS devices built on larger wafers. EVG has already delivered several GEMINI systems built on the new equipment platform to multiple leading MEMS manufacturers.

    According to Yole Group, the MEMS market is set to grow from US$14.6 billion in 2023 to US$20 billion in 2029 (1). This growth is largely driven by inertial sensors, microphones, and new generations of MEMS, including microspeakers, which are increasingly used in smartwatches, True Wireless Stereo (TWS) earbuds, and other consumer wearable devices. Many MEMS devices need to be protected from the external environment or can operate only under controlled atmosphere or vacuum. Metal-based wafer bonding (Eutectic, Transient-Liquid-Phase and Thermo-compression) plays an essential role in the manufacture of these MEMS devices by enabling hermetic sealing and pressure or vacuum encapsulation. 

    MEMS manufacturers have begun to transition from 200-mm to 300-mm production lines to achieve economies of scale and meet growing market demand for MEMS devices, as well as to support new device integration schemes such as CMOS-MEMS integration, and the production of MEMS devices with larger footprint, such as ultrasonic MEMS and micromirrors. However, migrating to 300-mm wafers requires significantly higher bond forces compared to 200-mm wafers to ensure the same bond pressure over a much larger surface area.

    EVG’s next-generation GEMINI system for 300-mm wafers exceeds the specifications required for 300-mm MEMS manufacturing – meeting the needs of both current and future MEMS device generations. An integrated modular HVM system for aligned wafer bonding, the GEMINI platform features up to four bond chambers with adjustable bond force (up to 350 kN), high vacuum (down to 5 x 10-6 mbar) and overpressure capability (2000 mbar abs.). It also maintains the industry-leading capabilities of the previous-generation platform, including fully automated optical alignment, full flexibility with customizable module configurations and support for a wide range of bonding processes. 

    “EVG has more than 30 years of experience providing production wafer bonding systems for the MEMS industry. Working closely with our customers and partners, we can see key trends and inflection points in this market very early on, and plan accordingly,” stated Dr. Thomas Glinsner, corporate technology director at EV Group. “Our next-generation GEMINI wafer bonding system is a prime example of EVG putting our long-term vision and experience into action. The result is the first wafer bonder of its kind for the MEMS industry, which helps our customers to stay on their technology roadmaps and bring innovative and exciting new MEMS devices and end-products to market.”

    Product Availability

    EVG is now accepting orders for the next-generation GEMINI automated production wafer bonding system, and is offering product demonstrations at EVG’s headquarters. For more information, please visit https://www.evgroup.com/products/bonding/permanent-bonding-systems/gemini

    Contacts:

    Clemens Schütte
    Director, Marketing and Communications
    EV Group
    Tel: +43 7712 5311 0
    E-mail: [email protected]

    David Moreno
    Principal
    Open Sky Communications
    Tel: +1.415.519.3915
    E-mail: [email protected]

Categories

100 Electronic System Design
  • Hardware & Software Co-Design Tools
  • Packaging Services
    • 200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dispensing Systems
  • Hot Embossing System
  • Litho for WLP: Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Printing Equip: Screen; Alignment ; Film
  • Tape Auto. Bonding (TAB); Bumped TAB (BTAB) Equip.
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 201 Flat Panel Display Equipment
  • Alignment Film Coating Equipment
    • 202 Other Equipment
  • Lamination; Sheet Laminating Equipment
    • 203 Inspection & Measurement Products
  • Defect; Particle; Contam. Detection/Review/Inspect.
  • Film Thickness; Uniformity Measurement; Ellipsometer
  • Metrology; Topology; Nanotopography; Flatness; Cryst.Orient.
    • 204 MEMS Equipment
  • Double sided mask aligner
  • Wafer Level Bonders
    • 205 Nanotechnology Equipment and Tools
  • Equipment, Nanotechnology Tools
    • 206 PV Equipment
  • Inspection and Metrology
  • Other
  • Thin Film
  • Wafers
    • 207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Coat; Develop; Resist Processing; Track Equipment
  • Lithography/Exposure
  • Wafer Identification; Marking Equipment
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 700 Manufacturing Services
  • Lithography; Patterning service
  • Measurement; Inspection Service

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