Welcome to American Fairfield Inc. at SEMICON West 2024!
Overview
American Fairfield Inc. is a leading supplier of high-performance materials for semiconductor packaging, thermal management, optical communication, and electronic assembly. We specialize in providing advanced adhesives, encapsulants, and thermal interface materials to enhance chip reliability, heat dissipation, and electronic performance across industries such as AI, HPC, 5G, and automotive electronics.
Featured Products at SEMICON West:
✅ COOLTHERM® Thermal Management Solutions – High-performance gap fillers, encapsulants, and adhesivesdesigned for power electronics, EV batteries, and semiconductor applications.
✅ BUF Build-Up Films – Advanced materials for wafer-level packaging, 3D integration, and chiplet technology.
✅ Hermetic Sealing & Electronic Adhesives – Precision bonding solutions for high-reliability microelectronics.
✅ Optical Communication Materials – Thermal adhesives and coatings optimized for fiber optics, photonics, and LiDAR systems.
📍 Visit us at our booth to explore our latest solutions!
Products