TOKYO SEIMITSU CO., LTD. (the Company; Head Office: Hachioji-shi, Tokyo; President and CEO: Ryuichi Kimura) has completed construction of the new Nagoya Plant, which was being built by its subsidiary Tosei Engineering Corp., as part of its efforts to further expand its semiconductor manufacturing equipment business. The completion ceremony was held on August 27, 2025.
Background and purpose of the new plant
In recent years, with the expansion of communication technologies such as AI, IoT, and cloud computing, the demand for semiconductors and electronic components has been increasing year by year. As a result, the demand for semiconductor production equipment (SPE) provided by the Company has grown significantly from semiconductor device manufacturers and electronic component manufacturers, and there is also an increasing demand for new SPE to produce high-performance devices.
In this context, grinding technology tailored to specific applications is essential for achieving the high performance of semiconductor devices, particularly in areas such as 3D packaging (advanced packaging) and compound semiconductor processing. As a result, demand for the grinders the Company manufactures and sells continues to grow.
Furthermore, in recent years, a technology called “hybrid bonding” has been proposed, which enables high-density packaging by precisely stacking and bonding multiple semiconductor chips or wafers. This process is expected to play a crucial role in the development and mass production of next-generation semiconductor devices. In this process, high-precision grinding processes that “thin and uniformly reduce the thickness of wafers and ensure flatness for bonding” are indispensable, and grinders with even higher precision than before are now in demand.
In response to this market environment, the Company has determined that securing production capacity for grinders for hybrid bonding, which are expected to present significant mid- to long-term business opportunities, is an urgent priority for establishing a stable production and supply system for grinders.
The completed new Nagoya Plant is primarily dedicated to the production of grinders for hybrid bonding, while also manufacturing other back grinders for silicon wafers. This expansion is expected to approximately double the Tokyo Seimitsu Group’s grinder production capacity compared to previous levels.
Tokyo Seimitsu Co., Ltd. will continue to support its global customers' manufacturing operations with an even stronger and more robust business structure.
Establishment of Chubu Metrology Center
The Company is also pleased to announce the establishment of Chubu Metrology Center within new Nagoya Plant as a facility dedicated to deepening understanding of precision measurement technology. This center will serve as a hub for providing technical support and solutions tailored to the needs of the Chubu region, which is a major manufacturing hub in Japan. Through this initiative, the Company will further enhance its ability to address its customers' measurement challenges with tailored proposals and solutions.
The center features a wide range of products, including coordinate measuring machines, non-contact contour measuring instruments, and surface texture measuring instruments, all of which are on display. The Company has created an environment where it provides customers with measurement evaluation, equipment operation, and solution proposals with one-stop.
Furthermore, the Company plans to collaborate with local educational institutions and local companies to host study sessions and facility tours, thereby fulfilling the role of an educational hub for precision measurement.
Outline of the new Nagoya Plant
| Name |
Tosei Engineering Corp. Nagoya Plant |
| Address |
Togo-cho, Aichi-gun, Aichi Prefecture |
| Building description |
2 floors above ground (steel structure) |
| Total site area |
35,887.68m2 |
| Total floor area |
13,134.82m2 |
| Main production item |
Grinders, Wafer Demounting and Cleaning Machines, Dedicated Measuring Machines |
| Start of operation |
From August 27, 2025 onwards |