Loading...

Teikoku Taping System, Inc.

Phoenix,  AZ 
United States
http://www.teikoku-taping.com/en
  • Booth: 1571

Overview

Teikoku Taping System is an innovative leading supplier for semiconductor industry. Our porfolio covers a comprehensive range of products and solutions for Mid-end and back end semiconductor manufacturing.

A leading equipment supplier for Dry Film applications.

  • Wafer and Panel Laminating System
  • Tape Removing System
  • Wafer Mounting System
  • UV Irradiation System

  Products

  • Fully Automatic Tape Laminator -DXL/EXL Series
    Standalone wafer laminator. ...

    • Applicable wafer size: DXL series= 100,150, 200mm  /EXL series=300mm (12inch)

    Cutting type : Blade or Laser

    DXL seires: WxDxH : 1250 x 1400 x 2200

    EXL series: WxDxH : 1350 x 1750 x 2200

  • Fully Automatic Tape Remover
    Standalone Tape remover....

    • Applicable wafer size : 150mm, 200mm, 300mm

    Selectable removing type: Sticky Tape or heat Seal

    Dimensions (WxDxH) in mm: 1250 x 1400 x 2000

Categories

200 Packaging and Assembly Equipment
  • Wafer Mount; Taping Equipment
    • 202 Other Equipment
  • Lamination; Sheet Laminating Equipment
    • 207 Process Equipment
  • Coat; Develop; Resist Processing; Track Equipment
    • 300 Packaging and Assembly Materials
  • Package Substrates; Laminate; Film based
    • 900 Support Products
  • Tools

    • Send Email

    Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".

    Loading ...

    :
    :


    Legend
    Available Timeslot
    Scheduled Appointment
    Personal Appointments
    Appointment Request
    Blocked Timeslot
    Restricted Timeslot
    Cancelled
    Declined