MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation high precision MRSI-175Ag epoxy dispenser. This latest innovation is a significant improvement in MRSI’s epoxy dispensing solutions focusing on speed, accuracy, safety, and ergonomics.
The next-generation epoxy dispenser represents an ultra-high-speed, flexible solution with multiple dispensing methods and materials, including silver-filled epoxies, conformal coating, sintering paste, thermal grease, and UV adhesive, among others. The system is highly configurable for complex applications, such as microwave modules, optical modules, hybrid circuits, multichip modules, advanced packaging, and semiconductor packaging. Moreover, it offers precise process control and is 35% more energy efficient than previous systems.
Our customers now have two options from this new product. The MRSI-175Ag is our standard option for 25µm accuracy. The MRSI-175Ag+ is an available option that achieves 10µm accuracy.
Francesca Navarro, Product Manager, MRSI Mycronic, expressed enthusiasm about the launch: "We are excited to introduce the next generation high precision epoxy dispenser and remain committed to ongoing innovation to meet the needs of our customers."
For further details regarding MRSI and the next generation epoxy dispenser please visit https://www.mycronic.com/product-areas/die-bonding/ or reach out to [email protected].
For additional information, please contact:
MRSI Global Sales
MRSI Systems, 554 Clark Road, Tewksbury, MA 01876 USA
Tel: + 1 978 667 9449
E-mail: [email protected]
Francesca Navarro
Product Manager
MRSI Mycronic
Tel: + 1 978 667 9449
E-mail: [email protected]
About MRSI Systems
MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 40+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging.
About Mycronic
Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, Mexico, the Netherlands, Singapore, South Korea, United Kingdom, the United States and Vietnam. Mycronic is listed on Nasdaq Stockholm. www.mycronic.com