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Zhengzhou Research Institute for Abrasives & Grinding Co. Ltd.

Zhengzhou, Henan, P.R. China,  China
http://en.diamondgroup.cn/?lang=en
  • Booth: 565

Best solution on dicing blades, chucks and grinding wheels.

Overview

Founded in 1958, ZZSM is the unique R&D unit for the abrasive industry in China. 


As the biggest professional leader in this specific area, our main products are dicing blades, singulation blades, chuck tables and other relative products in dicing and singulation application. 


For dicing process, dicing blades for wafers, singulation blades for BGA,QFN, DFN, ceramic substrate, glass and so on can have excellent quality. 


For grinding process, our back grinding wheels for silicon wafer,  SiC wafers and sapphire, edge grinding wheels, notch wheels and so on will help cost down with best life and grinding quality. 


Chuck tables, flanges and wheel mounts, UV tape, dressing boards can provide best solution for you. Fine pore ceramic chuck table has good flatness and parallelism. Size from 2", 4", 6", 8 ",12", max 500mm, round/rectangular and other special shapes are available. 


Monocrystalline and Polycrystalline MPCVD for optical, thermal conductivity, cooper diamond composite is available.

  Press Releases

  • Sinomach Diamond (Henan) Co., Ltd. covers all key segments of the diamond industry upstream, midstream, and downstream.

    Raw and Auxiliary Materials: Focusing on the two technological routes of synthesizing superhard materials through HTHP and CVD, we produce core raw materials, auxiliary materials, superhard material single crystals/micro-powders, composite superhard materials, and large-sized single crystal/polycrystalline diamonds. For example, rough diamonds/bare diamonds produced by the MPCVD method are characterized by high purity, good fire, and no fluorescence. We offer customized products in various sizes of square and rectangular rough diamonds, as well as finished white and colored diamonds of different sizes.

  • Sinomach Diamond (Henan) Co., Ltd. covers all key segments of the diamond industry upstream, midstream, and downstream.

    Sinomach Diamond (Henan) Co., Ltd. offers structured application products targeting aerospace, deep-sea and deep-earth exploration, semiconductors, new energy, and new energy vehicles. These include superhard grinding tools, superhard cutting tools, precision specialty materials, and non-grinding applications of superhard materials. For instance, ZZSM's three-grinding superhard grinding tools are widely used in industrial manufacturing sectors such as automotive, tooling, gears, and bearings, known for their high efficiency and precision.

  • Sinomach Diamond (Henan) Co., Ltd. offers functional diamond products that focus on the functional applications of diamond in terms of acoustics, optics, electricity, magnetism, and thermal conductivity. These include diamond water treatment electrodes, diamond acoustic diaphragms, diamond thermal management solutions, optical windows, and diamond semiconductor materials. For example, single-crystal diamond heat sinks with a thermal conductivity of 1800-2200 W/m・K are mainly used for direct heat sinking of high-frequency and high-speed chips, and can meet the heat dissipation requirements of ultra-high power chips with over 700W.

  Products

  • Diamond-Copper/Aluminum-Based Composite
    Mainly used in laser devices, microwave power devices, high-power semiconductor lighting and other fields, it is an excellent thermal management material for heat dissipation of high heat flux density devices....

    • Mainly used in laser devices, microwave power devices, high-power semiconductor lighting and other fields, it is an excellent thermal management material for heat dissipation of high heat flux density devices. Diamond/copper, diamond/aluminum high thermal conductivity composite materials have the characteristics of high thermal conductivity and low coefficient of thermal expansion. The room temperature thermal conductivity is more than twice that of copper-molybdenum (CMC, CPC) heat dissipation materials. Diamond-Copper/Aluminum-Based Composite Heat Dissipation Materials Highest thermal conductivity：Copper 800W/（m·K）； Aluminum 560W/（m·K）；
  • CVD Diamond Heat Sink
    Size： 1-6inches，Customizable； Thickness： 0.25-1mm，Customizable； Thermal conductivity： 1000-2200W/(m·K)@25℃； Coefficient of thermal expansion： 1±0.1ppm/K@25℃； Thickness deviation： ±0.03 mm； Roughness： ＜10nm；...

    • Mainly used for high-power RF devices such as RF amplifiers and microwave amplifiers, high-power devices such as laser tube diodes, laser tube diode arrays, high-power transistors, as well as compound semiconductor devices such as GaN, GaA, SiC, etc.

    It has the characteristics of high mechanical strength, good insulation, low dielectric constant, and light weight. Its room temperature thermal conductivity is more than 5 times that of copper, which can enable semiconductor devices to achieve higher power density and improve reliability in a smaller space. It is the best thermal management material for heat dissipation of high heat flux density 

  • ESC Chuck
    It is for core key processes such as etching, thin film deposition, ion implantation, ashing, etc. in semiconductor  front processing.The material is alumina ceramic (Coulomb type, purity 96%, 99.6%), which can provide products of 12 inches and below....

    • Mainly used for core key processes such as etching, thin film deposition, ion implantation, ashing, etc. in semiconductor  front processing.

    Adopting the principle of electrostatic adsorption for flat and uniform clamping of ultra-thin clean wafers, it has the characteristics of uniform adsorption force, no pollution, no damage, and can be applied in high vacuum environments.

    The material is alumina ceramic (Coulomb type, purity 96%, 99.6%), which can provide products of 12 inches and below, with a working temperature of -30 to+180 ℃; Ceramic surfaces can be slotted, embossed, and have optional roughness.

Categories

1 FLEX
  • Tools & Equipment
    • 200 Packaging and Assembly Equipment
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
    • 307 Process Materials
  • CMP; Grind; Lap; Polish; Abrasive materials
    • 308 Substrates
  • Diamond substrates
    • 400 Components, Parts & Accessories
  • Chucks for Wafer and other Substrates
    • 700 Manufacturing Services
  • Sawing; Lapping; Grinding; Polishing Service

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