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ENGRICH SOLUTIONS SDN BHD

BAYAN LEPAS,  PENANG 
Malaysia
http://www.engrichsolutions.com
  • Booth: 751

Welcome Semicon West 2025 Phoenix Convention Center Booth751

Overview

We’re excited to be part of SEMICON West 2025 in Phoenix and thrilled to welcome you to our booth! Explore our latest innovations in our product – e.g., die attach solutions, wire bonding technology, precision tools, etc., and speak with our technical experts, and discover how we’re shaping the future of semiconductor packaging.

Whether you’re looking to solve a specific challenge or just exploring what’s new, we’re here to help and share insights.

Let’s connect — we look forward to meeting you!


  Products

  • Dispensing Nozzle
    The Dispensing Nozzle is a precision-engineered component designed for accurate and consistent material application in die attach processes....

  • High Precision Dispensing: Engineered for micro-level accuracy, enable uniform and repeatable line or dot patterns essential for die bonding. 

    Material Options:

    • Stainless Steel (SS303)
    • Harden Steel ( 440C)
    • Tungsten Carbide (WC)

    Nozzle Inner Diameter (ID)

    • Standard: 23G~32G (Minimum 0.10mm)
    • Holes size : minimum 0.08mm

    Tip Style Options:

    • Tubings
    • Grooving Shape - X,Y, Star and etc..
    • Single or Multi Holes 

    Mounting Capability:

    • Fit for most industry-standard die attach systems ( Datacon, Esec, ASM , Alphasem, Palomar, Canon, Muehbauer, etc,)
  • Pickup Tool
    A high-precision tool designed for reliable handling and placement of semiconductor dies during die attach process....

  • Precision Handling: Enables secure and stable pick-up of bare dies, ensuring accurate alignment and placement during high-speed bonding.

    Custom Tip Designs: Avalaible in varius tip geometries - flat, convace, relief , multi-holes to accommodate different die shapes, sizes and materials.

    High-Quality Material: Manufactured from durabe, non-contaminating materials such as ESD-safe rubber, polyamides to prevent damge to delicate dies.

    Machine Compatibility: Compatible with major die attah equipment plaforms including ASM, Palomar, Datacon, Esec and etc..

    Applications:

    • Pick-and-places operatios in die attach
    • MEMS, LED, RF,MLP and microelectronic packaging
    • Flip Chip and Eutectic bonding processes
    • Optical and phtonic devise assembly

  • Metal 3D Printing
    Also known as metal additive manufacturing, is a process of creating solid metal parts directly from digital 3D models by building them layer by layer....

  • Metal 3D printing, also known as metal additive manufacturing, is a process of creating solid metal parts directly from digital 3D models by building them layer by layer. Unlike traditional subtractive manufacturing (like CNC machining), which removes material from a solid block, metal 3D printing adds material only where needed, reducing waste and enabling highly complex geometries.

    Key Features:

    Works with metals like titanium, stainless steel, aluminum, Inconel, copper, and tool steels
    Capable of producing complex, lightweight, and custom parts
    Enables low-volume production without the need for expensive tooling
       Advantages:
    Design freedom: Create internal channels, lattice structures, and organic shapes
    Rapid production: Shorter lead times from design to part
    Material savings: Near-net-shape manufacturing with minimal waste
    Customization: Perfect for prototypes, medical implants, and aerospace parts
    🏭 Applications:
    Aerospace: Jet engine components, structural brackets
    Medical: Orthopedic implants, dental prosthetics
    Automotive: Lightweight performance parts
    Tooling: Custom inserts, molds with conformal cooling
    Energy: Turbine blades, heat exchangers


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