Yield Engineering Systems, Inc.

Fremont,  CA 
United States
http://www.yes.tech

• Booth: 829

Engineering the Intelligent Future

Overview

YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company's products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.

  Press Releases

• YES Delivers Multiple VertaCure™ LX Systems (Sep 04, 2025)

  FREMONT, Calif.--(BUSINESS WIRE)--Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced the delivery of multiple VertaCure™ LX curing systems to one of Taiwan’s top outsourced semiconductor assembly and test (OSAT) providers. These systems will support advanced packaging processes for Edge Computing and HPC solutions, delivering critical low-temperature curing, annealing, and degassing for WLCSP, Plated Bump, and Cu Pillar applications.

  The VertaCure LX is a fully automated vacuum curing and degassing system engineered to ensure uniform temperature distribution and precise control of heating and cooling rates. This results in complete solvent removal, improved film properties, elimination of outgassing after cure, and outstanding particle performance. YES products have consistently demonstrated superior quality in curing, coating, and annealing across both R&D and high-volume manufacturing environments.

  “The VertaCure family has become the industry’s most widely adopted high-volume manufacturing (HVM) curing solution for 2.5D packaging,” said Rezwan Lateef, President of YES. “These systems deliver exceptional mechanical, thermal, and electrical performance across wafer-level, 2.5D, and 3D packages. Adoption by leading IDMs and foundries has already validated the platform, and we’re excited to see growing demand from OSAT customers as well. This momentum strengthens our market leadership in advanced packaging.”

  Alex Chow, SVP of Sales and Business Development and Asia President at YES, added, “VertaCure LX systems deliver more than 30% improvement in thermal uniformity and 30% lower cost of ownership in HVM. We anticipate follow-on and volume purchase orders from this customer in 2026. This shipment marks another milestone that solidifies YES as the market leader in curing technology for advanced packaging.”

  About YES

  YES is a leading provider of differentiated technologies for materials and interface engineering needed for a wide range of applications and markets. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.

• YES Receives Orders for Multiple VertaCure™ G3 Systems From Asia’s Leading Foundry (Sep 04, 2025)

  FREMONT, Calif.--(BUSINESS WIRE)--Yield Engineering Systems (YES), a leading provider of process equipment for AI and HPC semiconductor applications, today announced orders of multiple VertaCure™ G3 curing systems from one of Asia’s top foundries. These systems will support advanced packaging processes for AI and HPC solutions, delivering critical low-temperature curing, annealing, and degassing.

  The VertaCure™ G3 is a fully automated vacuum curing and degassing system engineered to ensure uniform temperature distribution and precise control of heating and cooling rates. This results in complete solvent removal, improved film properties, elimination of outgassing after cure, and outstanding particle performance. YES products have consistently demonstrated superior quality in curing, coating, and annealing across both R&D and high-volume manufacturing environments.

  “The VertaCure™ family brings transformative vacuum curing technology to high volume manufacturing (HVM) of advanced packaging and has become industry’s most widely adopted solution,” said Rezwan Lateef, President of YES. “VertaCure™ G3 is our latest offering that delivers exceptional mechanical, thermal, and electrical characteristics across wafer-level, 2.5D, and 3D packages. This platform provides the highest level of performance that leading edge foundries depend upon for bringing out new packaging technologies. This purchase order solidifies our leadership in curing equipment.”

  Alex Chow, SVP of Sales and Business Development and Asia President at YES, added, “VertaCure™ G3 has a 6-zone temperature control system with laminar flow for excellent uniformity and particle performance required for Polyimide, PBO, and epoxy cure. It delivers excellent thermal uniformity of ± 1°C at > 200 °C during dwell and ramp, which is essential for PI curing of thick films. With more than 500 VertaCure™ chambers in use for advanced packaging, YES has over 90% market share.”

  About YES

  YES is a leading provider of differentiated technologies for materials and interface engineering. YES customers are market leaders, creating next generation solutions for a variety of markets including advanced packaging for AI and HPC, Memory Systems, and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor advanced packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via and Cavity Etch, and Electroless Deposition tools for the semiconductor industry. Headquartered in Fremont, California, YES has a growing global presence. Please visit YES.tech.

• YES Receives Multiple VeroTherm™ and VeroFlex™ System Orders from Leading Memory Supplier (Oct 02, 2025)

  FREMONT, Calif.--(BUSINESS WIRE)--Yield Engineering Systems (YES), a leading provider of process equipment for advanced packaging for AI and HPC systems, today announced that it has received multiple orders of VeroTherm™ and VeroFlex™ reflow systems from one of the largest memory suppliers. These systems will enable 3D stacking of memory and logic chips for high-performance AI accelerators, driven by large language model (LLM) applications.

  The VeroTherm™ and VeroFlex™ reflow systems are designed to provide solutions for achieving sub-10μm micro-bump structures with fluxless solder and mass reflow processes in a low vacuum environment for wafers and panels respectively. These systems enable superior quality and total cost of ownership (CoO), particularly for the manufacturing of advanced packaging architectures such as stacked logic and high bandwidth memory (HBM) that are an integral part of AI accelerators.

  “The VeroTherm™ and VeroFlex™ process platforms deliver enhanced thermal uniformity and mechanical reliability for advanced packaging applications requiring ultra-fine pitch interconnects. Our validation studies demonstrate zero-defect reflow performance with no evidence of bump fracture or structural collapse at pitches as aggressive as 10μm,” said Rezwan Lateef, President of YES. “The proprietary process architecture achieves deterministic solder joint formation while maintaining statistical process control metrics that enable high-volume manufacturing with optimized cost-per-unit economics. These customer adoptions represent significant technical validation of our solution in the heterogeneous integration and 3D-IC assembly market segments,” Lateef added.

  According to Alex Chow, SVP of Sales and Business Development and Asia President at YES, “Our VeroTherm™ and VeroFlex™ product families offer vacuum processing with unique capabilities of removing oxides and reflowing solder into excellent bump shapes without defects found in older atmospheric pressure systems. These tools eliminate SnAg agglomerate defects and rough surfaces while minimizing inter-metallic compound zones, extending down to sub-10μm pitches.”

  About YES

  YES is a leading provider of differentiated technologies for materials and interface engineering. YES customers are market leaders, creating next generation solutions for a variety of markets including Advanced Packaging for AI and HPC, Memory Systems and Life Sciences. YES is a leading manufacturer of state-of-the-art cost-effective high volume production equipment for semiconductor Advanced Packaging solutions for wafers and glass panels. The company’s products include Vacuum Cure, Coat & Anneal Tools, Fluxless Reflow tools, Thru Glass Via, and Cavity Etch and Electroless Deposition tools for the semiconductor industry. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit YES.tech.

  Products