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Technic, Inc.

Cranston,  RI 
United States
http://www.technic.com
  • Booth: 1592

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Overview

Fabrication & Packaging Electroplating Chemistries for Advanced Semiconductor Applications

Technic’s Elevate® line of semiconductor fabrication and packaging electroplating chemistries is recognized worldwide for innovation, performance, and reliability. Elevate® processes deliver advanced solutions for copper, nickel, tin, and precious metal plating.

Complementing these offerings, Technic also provides TechniStrip® photoresist strippers for both liquid and dry film resists, as well as TechniEtch® metal etchants and TechniClean cleaners engineered for a wide range of substrates.

By delivering advanced solutions in electroplating chemistry, photoresist strippers, cleaners, metal etchants, high-purity wet chemistry, and semiconductor manufacturing equipment, Technic provides a comprehensive portfolio for fabrication and packaging. With application-specific product development and unmatched analytical expertise, Technic equips semiconductor manufacturers with the critical tools needed to overcome process challenges, enhance reliability and yield, and advance the next generation of semiconductor technology.


  Press Releases

  • Technic’s 601 Facility in Woonsocket Marks Major Milestones in Local Manufacturing

    Woonsocket, RI –Over the past year, Technic’s 601 Facility in Woonsocket, Rhode Island, has quietly grown into a cornerstone of the company’s North American manufacturing strategy. What began as a vision for regional production has become a series of tangible achievements—each one a step forward in delivering high-performance chemistries with greater speed, efficiency, and flexibility.

    The momentum began in 2024 with the successful qualification and final customer approval of TechniStrip® NF52, a key product now manufactured locally and readily available to all customers. This milestone marked more than just an internal success; it signaled the beginning of a larger shift toward domestic production capabilities that offer improved responsiveness to customer needs.

    Building on that success, TechniStrip® NF90 was qualified for local manufacturing in Q2 of 2025. Customer approvals for this product are anticipated by Q3, paving the way for broader adoption. Shortly after, in Q3 2025, TechniEtch® CuSelect is set to be qualified at the facility, with final customer approvals expected by year’s end.

    Thanks to this facility expansion, Technic can better serve its North American semiconductor customers, providing locally manufactured products with reduced lead times and improved availability, all while maintaining the high standards of quality and performance that Technic is known for.

    These milestones are part of a deliberate, phased approach to expanding local production at the 601 Facility. Looking ahead to 2026, Technic plans to add even more products to its Rhode Island manufacturing portfolio. While the final lineup is still being determined, candidates under consideration include the NI SeriesMLO SeriesTBR SeriesMicroD2CA25, and BOS390.
     

    Read more

  • Newly Inaugurated Semiconductor Chemical Plant Marks a New Era for Technic


    Amiens InaugurationAmiens, France – Technic is marking a new chapter in its growth with a major expansion. We are proud to announce the inauguration of Technic Ultra Purea state-of-the-art chemical plant in Amiens, France, that will allow Technic to meet the growing demand for bulk semiconductor materials production and better serve its global customers.

    Spanning over a 25,000-square-meter area, Technic Ultra Pure includes three main buildings and is equipped with the latest industry 4.0 technologies, such as real-time monitoring and an ultra-trace quality control laboratory. Advanced safety measures and robust storage solutions, including several hundred cubic meters of underground storage and mixing tanks, ensure the safe management of chemicals while mitigating environmental risks.


    This expansion reaffirms our commitment to supporting the evolving needs of the semiconductor market in Europe and beyond. By increasing our production capacity and enhancing infrastructure, we are better positioned to meet rising demand, while maintaining the highest standards of safety and environmental responsibility.

                      - Philippe Vernin, President of Technic France

    The newly inaugurated chemical plant embodies Technic’s commitment to safetyoperational excellence, and sustainability, as the company continues to invest in R&D and production projects focused on developing safer, more sustainable solutions for semiconductor manufacturing.

    Technic Ultra Pure follows four existing plants and two R&D centers in France, confirming Technic’s continued leadership in the semiconductor materials industry, while driving innovation and maintaining high standards of safety and sustainability.

    Read more


  Products

  • Elevate Cu 3000
    Elevate® Cu 3000 is a versatile copper plating process for advanced packaging. Using a single organic system, it plates RDL patterns, copper pillars, and more, with adjustable profiles, all fully analyzable via Technic’s Elevate® Analyzer....

  • Elevate® Cu 3000 delivers precision and flexibility for advanced semiconductor packaging. Its single organic system efficiently plates RDL patterns, copper pillars, and a variety of other complex features, while allowing easy adjustment to achieve flat, convex, or concave profiles. Fully compatible with Technic’s Elevate® Analyzer, all organic and inorganic components can be thoroughly monitored, ensuring consistent quality and performance.
  • Elevate Cu 1500
    Elevate® Cu 1500 delivers superior via fill and leveling for advanced semiconductor applications. Proven to fill vias with aspect ratios up to 10:1, it’s the ideal solution for high-density interconnects (HDI) and demanding packaging requirements....

  • Elevate® Cu 1500 is a high-performance MSA-based copper plating process engineered to deliver exceptional via fill and superior leveling for advanced semiconductor applications. Specifically formulated for demanding designs, it has been proven to fill vias with aspect ratios up to 10:1, ensuring reliability and consistency in even the most challenging structures. This makes Elevate® Cu 1500 an excellent choice for high-density interconnects (HDI) and other advanced packaging requirements, where precision and performance are critical.

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