Micro Control Company

The LC-3 is a sophisticated burn-in-with-test system that manages advanced requirements through its ability to perform dynamic burn-in with test. The LC-3 burn-in system is designed for production burn-in of logic, mixed signal, analog, and memory devices. With 50% more power supplies than an HPB-5C, double the number of temperature control channels than an LC-2 and up to 32 user-defined independent pattern zones, the LC-3 is the future of burn-in.

Features:

• Individual temperature control per device under test for 48 20-watt devices per BIB. (80 watts for fewer devices)
• Programmable chamber control up to 150°C and individual temperature control to 175°C.
• 24 total power supplies per BIB; 544A and 2240W available per BIB; limited to 1000W.
• 16 high power individually programmable power supplies (30A, .5V to 9.5V, 120W) per BIB.
• 8 low power individually programmable power supplies (8A, .25V to 5.0V, 40W) per BIB.
• Analog voltage supplies are optional.
• Up to 32 patterns/power zones.
• 128 formatted vector I/O channels and 128 unformatted BIB input only channels.
• Compatible with other Micro Control Company burn-in systems.
• Adaptable to industry standard BIBs.
• Runs on Micro Control Company’s C-Breez software, using vectors compatible with both the LC-2 and HPB-5C

Benefits:

• Ensures proper thermal stress for up to 50W DUTs
• Enables high-volume production burn-in at the same time
• Allows use of existing burn-in boards
• Burn-in multiple device types at the same time
• Exercise and test more devices in parallel
• Stress at optimum temperature
• Programming flexibility
• Test both logic and memory functions
• Run test vectors without time-consuming reloads
• Flexible DUT power

The only advanced, high-performance burn-in system capable of performing dynamic burn-in with test on 1000-watt devices.  The HPB-6 High-Power Burn-In with Test system is ideally suited for production screening, engineering characterization, and lifetime testing applications of logic devices and multi-die packages.

Features:

• Handle devices up to 1000 watts
• Water-cooled, high-force sockets for individual temperature control per device
• 16 independent burn-in board slots
• 24 high-power individually programable power supplies (250 W, 175 A, 0.3V to 1.8V) per board
• 24 low-power individually programable power supplies (60 W, 15 A, 0.3V to 4.0V) per board
• 64M standard and 128M optional parallel vector depth – subroutine capable
• 8G scan vector depth
• 128 formatted vector I/O channels plus 128 vector output-only channels
• 100 MHz fast scan mode rep-rate on 16 dedicated channels
• 8 programmable high-frequency clocks, up to 350 MHz – LVDS to the BiB
• Standalone chiller for easy maintenance

Benefits:

• High number of regulated power supplies for isolating circuits inside the DUT
• Highest DUT power available for burn-in
• Device temperature is maintained throughout test ensuring accurate readings
• Ensures proper thermal stress for each device
• Exercise and test high pin count devices or more parts in parallel
• High current regulators to supply required power to DUTs
• Translate and run device test programs
• Multiple clocks available for self-test
• Test both logic and memory functions
• Run large numbers of test vectors without time-consuming reloads

The HPB-5C+ Burn-In with Test System meets the challenges created by wide variation in heat dissipation, and the diverse burn-in needs high-power VLSI devices. The active thermal control feature provided by the HPB-5C+ ensures that the proper thermal stress is applied to each device during the burn-in cycle.

Features:

• Individual temperature control for each device up to 150 W
• Variable oven overflow control
• Individual pattern zone per burn-in board slot
• 32M vector memory standard, 64M optional
• Tests devices at a temperature of up to 150°C
• Up to 800 MHz clock rate
• 128 digital I/O channels per burn-in board
• System capacity of 384 devices under test with individual temperature control per device
• 16 programmable voltage regulators with 1080 amps of device under test power per burn-in board
• 8 high-current supplies
  • (0-4 volts at up to 125 amps each)
• 8 low-current supplies
  • (0-6 volts at up to 10 amps each)

Benefits:

• Testing capabilities for high-power devices
• Ensures proper thermal stress for each device
• Measures device temperature more accurately
• Testing is more cost-effective due to greater system capacity resulting in higher throughputs
• Exercise and test high pin count devices or more parts in parallel
• Run large numbers of test vectors without time-consuming reloads
• Up to 16 different pattern zones with one burn-in board per zone
• Up to 2000 Watts of device under test power available per slot
• Translate and run device test programs
• Clock devices with built-in self-test (BIST) at high speed
• Flexibility to test complex devices
• Stores failure information without slowing down the test
• Test both logic and memory functions
• Flexible system protection control for more detailed reports of failure