Wacom Corporation

The Amada DBSAW500 and DBSAW1000 Diamond Band Saws are engineered for high-precision slicing of SiC, sapphire, ceramics, and quartz.

Both use a continuous diamond band blade for high removal rates, minimal kerf loss, and superior edge quality.

DBSAW500: Compact footprint ideal for R\&D and small wafer processing; precise feed control supports tight tolerances and fine cutting of smaller workpieces.

DBSAW1000: Expanded cutting capacity and higher throughput for large substrates and production environments; robust frame ensures stability and dimensional accuracy on oversized materials.

Both models feature optimized blade tensioning, advanced coolant management, and automation options to extend blade life, reduce consumable costs, and maximize process yield. Together, they provide scalable solutions from lab development to volume manufacturing.

【Features】
・Ideal for insulating depositions and diffusion/plasma mask depositions.
・Low particle film deposition by single-wafer face-down deposition.
・High safety and deposition stability by using a sealed chamber.
・Wafer warp correction function (patented) for SiC wafers.
・Low-load, long-cycle maintenance.
・Compact cabinet and adjacent installation to the mirror type for space saving.
・Low CoO (low running cost)

【Applications】
・Interlayer dielectric deposition for power semiconductors (NSG/PSG/BPSG)
・Hard mask for diffusion/ion implantation, Sacrificial depositions (NSG)
・Passivation depositions (protective depositions, insulating depositions) (NSG)
・Optical Waveguide (NSG/BPSG)