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AGC Inc.

千代田区,  東京都 
Japan
http://www.agc.co.jp/company/profile.html
  • Booth: 655

AGC is a global leader in semiconductor materials solutions.

Overview

AGC is a global leader in advanced materials and chemical solutions, delivering innovation across he semiconductor value chain.  At Semicon West 2025, AGC will showcase its comprehensive portfolio of high-performing materials designed to meet the evolfing needs of front-end and back-end semiconductor manufacturing.

AGC will exhibit Glass Carrier used for advanced packaging of semiconductor, Through Glass Vias, CMP Slurry, Post CMP Cleaner, PCB materails as well as Film, Resin products, Ceramics and Plasma-resistant coating used in semiconductor manufacturing processes and equipment, highlighting innovations from front-end fabrication to advanced packaging that drive global chipmaking forward.

In addition, AGC will highlight its commitment to fluorinated material recycling, in line with AGC Chemicals' Vision of "Chemistry for a Blue Planet", aming to contribut to an environmentally friendly and sustainable recycling-oriented society.


  Press Releases

  • Tokyo, Japan – July 18, 2025 - AGC (AGC Inc., Headquarters: Tokyo; President: Yoshinori Hirai), a world-leading
    manufacturer of glass, chemicals and other high-tech materials, proudly announces the launch of surfactant and
    fluorinated polymerization solvent free grades in its fluoroelastomer “AFLAS™ FFKM” series; the SF grades (the
    “Products”). The newly developed Products are manufactured entirely without the use of any surfactants*1 or
    fluorinated polymerization solvents*2. The Products offer high performance equivalent to that of conventional
    products, while meeting the growing market demand for fluoroelastomers that do not use surfactants or fluorinated
    polymerization solvents during the manufacturing process. This has been achieved through AGC’s innovative,
    proprietary polymer manufacturing technology (Surfactant-Free & Fluoro Solvent-Free Technology, hereafter the
    “Technology”). Initially, this Technology will be applied to the high-temperature-resistant type of FFKM
    fluoroelastomers and new grades will be added to the “AFLAS™ FFKM” series for semiconductor manufacturing
    equipment. Commercial availability of this new grade begins this month. We are planning to extend the Technology
    to other types of FFKM fluoroelastomers and will progressively introduce those new types of Products as part of
    “AFLAS™ FFKM” series.


    The “AFLAS™ FFKM” series is an industrial elastomer that offers one of the highest levels of resistance to
    chemicals, heat, and plasma among fluoroelastomers. Its outstanding properties make it exceptionally durable
    even in harsh environments such as semiconductor manufacturing, oil drilling, and healthcare. In particular,
    “AFLAS™ FFKM” is recognized as an essential material in the etching process, one of the key steps in
    semiconductor manufacturing, due to its exceptional plasma resistance. Its resistance to degradation makes it an
    ideal sealing material for etching equipment, where it contributes to significantly extended maintenance intervals
    and enhanced operating safety.


    Previously, surfactants and fluorinated polymerization solvents were considered essential for manufacturing high
    performance fluoroelastomers, FFKM, due to their roles in enhancing the reactivity of fluorinated monomers and
    manufacturing efficiency. In recent years, however, customers’ demand for products that do not use these
    substances during the manufacturing process have grown rapidly, particularly in the semiconductor industry.
    While various approaches without using surfactants or fluorinated polymerization solvents have been explored,
    achieving the high-performance requirements of FFKM was a significant challenge.


    To meet this market demand, AGC has successfully overcome this long-standing technical challenge and
    succeeded in mass-production of the Products by applying the new Technology, which does not require the use of
    any type of surfactants or fluorinated polymerization solvents, which has been developed by refining our unique
    polymerization technology cultivated over many years. Accordingly, AGC is now proud to introduce the Products
    as new addition to its AFLAS™ FFKM series.


    Under its corporate philosophy of “Look Beyond” , the AGC Group is committed to supporting the lives of
    people around the world through its unique materials and solutions. Going forward, we will continue to contribute
    to the realization of a safe, secure, and sustainable society through our high-performance, high-quality materials.

    Notes
    *1 surfactant: A chemical substance used to mix non-mixable substances and form a homogeneous mixture called
    an emulsion. Also called an emulsion.
    *² polymerization solvent: A solvent used to promote polymerization reactions. Various solvents are selected
    depending on the type and purpose of polymerization. In emulsion polymerization, water is generally used,
    while in solution polymerization, solvents that easily dissolve the polymerizable monomer are used.
     

  • Japan Formum 2025, Phoenix Convention Center, Room 207, October 7th, 8:00AM - 7:00PM

    The Consulate-General of Japan in Los Angeles, the Japan External Trade Organization (JETRO), and the Japanese
    Chamber of Commerce and Industry of Arizona (JCCIAZ) will co-host Japan Forum 2025 during SEMICON West in
    Arizona, which will be held in the state for the first time. As the first large-scale Japan-focused program at SEMICON
    West, the Forum will highlight Japan’s world-leading innovations in advanced packaging materials and manufacturing
    equipment. The event will feature four sessions and a luncheon, bringing together industry leaders, academic experts,
    and professionals from both Japan and the United States. Through this full-day program, Japan Forum 2025 will
    showcase cutting-edge technologies and explore new opportunities for advancing the semiconductor industry and
    strengthening international collaboration.

    Event Overview

    Event Name: Japan Forum 2025
    Date: Tuesday, October 7, 2025 | 8:00 AM – 7:00 PM (Special Reception: 5:00 PM – 7:00 PM)
    Venue: SEMICON West Phoenix / Phoenix Convention Center Room 207
    Organizers: Consulate-General of Japan in Los Angeles, Japan External Trade Organization (JETRO)
    and Japanese Chamber of Commerce and Industry of Arizona (JCCIAZ)
    Los Angeles, CA / Phoenix, AZ , October 7, 2025 (Tuesday)

    Important Information for Participation

    Luncheon/Reception Registration
    1.Registration for SEMICON West is required first. Please complete your registration at semiconwest.org
    2.After registering for SEMICON West, those who wish to attend the Japan Forum Luncheon/Reception
    must also register via the official Japan Forum website through the application form or the dedicated
    Luncheon/Reception registration link: https://forms.gle/xy3uFTt1rk6acNrp7  

    Please note:
    Registration through the Japan Forum website is not required for sessions other than the Luncheon and Reception.
    As seating is limited, early registration is strongly encouraged. Please note that registration does not guarantee participation. Confirmation
    details will be sent via email to those who are successfully registered


    Participating Companies (in no particular order)
    TEL、AGC, Mitsubishi Material Corp、Sekisui Chemical、Resonac, Toray, JSR, Ulvac, Ushio, Tazmo,
    TOWA, University of Tokyo, University of Osaka, SMBC, Deloitte, etc.

    Official JAPAN FORUM 2025 Website:  Japan Forum 2025


  Products

  • TGV Glass Substrate
    TGV Glass Substate for Advanced Packaging...

  • Features

    • Precise fine pitch small TGV and Cavity formation
    • Available in wide variety of glass composition and thickness (0.2 ~ 1.0mm)
    • High aspect ratio (up to 20:1) at 1.0mmt
    • High modulus and CTE adjustability for Warpage Control
    • Panel format production (e.g. 510x515mm)

    Applications

    • Glass core for Advanced Packaging (e.g. Chiplet packaging substrate)
    • RF device (e.g. Integrated Passive Device, Antenna in Packaging)
  • Excellent Plasma-resistant coating (Y2O3/Y5O4F7)
    AGC can provide special Y2O3 and Y5O4F7 films with excellent plasma resistance. Unlike thermal spraying, AD and other PVD methods, AGC's yttrium films are very dense, have high hardness and a special crystal orientation....

  • ・By using the ion-assisted deposition method, we have succeeded in producing a special yttrium film with excellent plasma resistance.

    AGC's yttrium film has a different crystal orientation, high hardness, and high density than yttrium films made by thermal spraying, AD, or other PVD methods.

    ・It also has excellent plasma resistance in high-temperature environments; for example, its durability at 200°C is more than 60 times that of quartz.

    It is also possible to give the yttrium film heat resistance that will not crack even in environments of 500°C to 800°C.

    ・Applications include top plates, electrostatic chucks, and observation windows of etching and deposition equipment. Coatings can be made on a variety of substrates, including quartz, alumina, and AlN, so please contact us if there are any parts you would like to evaluate.

  • FluonⓇ ETFE film
    Fluon® ETFE Film is a high-performance fluoropolymer film, recognized as an industry-standard cushioning/release film in semiconductor molding processes....

  • Features

    • Resistance for Heat and Chemical
    • Properties of Mechanical, Anti-Stick and Electrical
    • Light Transmittance
    • Weatherability

    Applications

    • Release films for Semiconductor, LED lens, PCB ang CFRP
    • Protective films for Solar Cell surface, Rubber Closure and others
    • Structural Materials for Architecture, Sports Stadium and Greenhouse

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