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Scientech Engineering USA Corp.

Santa Clara,  CA 
United States
http://www.scientech.group/
  • Booth: 1940

Welcome to Scientech Booth, your partner for success !

Overview

Scientech Engineering USA Corp. was establised in 2015 at the heart of Silicon Valley.   Scientech USA office is a fully owned subsidiary of Scientech Corp. in Taiwan.  Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process. Our wet process equipment has been successfully verified in the latest Chiplet's 2.5D/3D packaging process technology and smoothly introduced into mass production.
Scientech wet process equipment with single-wafer and wet-bench type, can be highly customized to adapt new process flow and operational interface.   Scientech USA provide best-in-class trusted support to bridge semiconductor equipment manufacturers and industrial customers. 

  Press Releases

  •     The advancements in AI technology have indeed driven improvements in processing units, and these improvements often extend to the overall fabrication process of semiconductor devices. The demand for more powerful and efficient hardware to support AI workloads has led to the development of specialized accelerators. Graphics Processing Units (GPUs), Tensor Processing Units (TPUs), High Bandwidth Memory (HBM) and other custom-designed chips are being used to accelerate specific AI computations. The fabrication of these specialized chips involves advanced semiconductor manufacturing processes.
    Further, AI applications often require a mix of processing units optimized for different tasks. Heterogeneous integration involves combining different types of processing units, such as CPUs, GPUs, and accelerators, on a single chip or package. 3D chip stacking technologies have paved the path for improved performance, reduced latency, and increased overall system efficiency. Chips are stacked using various advanced packaging technologies, allowing multiple semiconductor dies to be vertically integrated. Stacking chips in this manner offers important advantages. Some common methods for stacking chips: Chip-on-Wafer-on-Substrate, Fan-Out Wafer-Level Packaging, and System-on-Integrated Chip.


       Handling and processing thin wafers mounted on a frame post-debonding, along with the subsequent cleaning process, presents formidable challenges in advanced semiconductor packaging technologies. Conventional cleaning methods carry the risk of damaging thinned wafers.
    To navigate these complexities, Scientech Corporation, a Taiwan-based leading semiconductor equipment manufacturer, leverages cutting-edge solutions for wafer-on-frame cleaning. Advanced handling equipment and robotic systems, meticulously engineered for precision control, play a crucial role. These technologies reduce the risk of damage during handling and ensure that delicate wafers are treated with the utmost care. Scientech’s commitment to innovative solutions in semiconductor equipment highlights its dedication to addressing the unique challenges posed by handling and processing ultra-thin wafers after debonding.
    Innovative cleaning techniques, specifically tailored to the unique characteristics of thin wafers, are deployed to enhance efficacy while minimizing potential harm. The ongoing development of specialized materials and processes further addresses challenges linked to the inherent flexibility, fragility, and intricate cleaning requirements of thin wafers mounted on frames post-debonding. 
    The continuous pursuit of technological advancements and the fine-tuning of processes are indispensable elements in the semiconductor industry's quest to improve yield and bolster the reliability of devices. One advantageous characteristic is the tool can handle various wafer sizes on a frame. Further, both the stand-alone wafer and wafer mounted on the frame can be processed in a single tool. These ongoing efforts are vital for mastering the intricacies of complex packaging processes and meeting the evolving demands of semiconductor manufacturing.


    About Scientech


    Scientech is a leading global provider of advanced semiconductor manufacturing equipment, specializing in wafer/Panel wet processing, bonding, debonding, and cleaning technologies. With a strong commitment to innovation and quality, Scientech partners with semiconductor manufacturers worldwide to enable the next generation of electronic devices.

    For More Information

    Visit : http://www.scientech.com.tw

    Contact:
    Kiran Kesavan日山
    Sales Manager, (Scientech)
    Mobile: +886-965-706-150
    E-mail：[email protected]

  • The demand for next-generation packaging solutions driven by AI, 2.5D/3D ICs, and heterogeneous integration has accelerated the need for cleaner, faster, and more reliable wafer separation solution. To meet this need, Scientech and PulseForge have jointly developed a fully functional Photonic Debonder, now ready for deployment in production environments.
    Built for Industry-Standard Production: This system is a fully production-qualified solution, designed in compliance with SEMI standards and optimized for integration into existing semiconductor manufacturing environments. It supports thin wafer handling and wafer on ring frame, effectively addressing contamination and yield concerns in advanced debonding applications.
    Key Features & Benefits
    ⦁ Stress Free Debonding: Minimal thermal impact with precise photonic energy.
    ⦁ Effective Handling: Can handle thin wafers and wafer on ring frame with high yield.
    ⦁ Material Versatility: Compatible with glass carriers, molded wafers, and various adhesives.
    ⦁ SEMI Standard: Ready for high-volume, industry-standard fabs.
    ⦁ Carrier Reusability: Reduces material costs and waste.
    ⦁ Lower Cost of Ownership: Energy-efficient and maintenance-friendly.
    ⦁ Faster Process Flow: Cuts time in pre/post bonding stages.
    ⦁ High Throughput: Faster than conventional laser debonding methods..
    Target Applications: AI Chip Packaging (Wafer/Panel), 2.5D / 3D IC Integration, Heterogeneous Packaging, Fan-Out Wafer-Level Packaging (FOWLP), Power Device Manufacturing
    About Scientech
    Scientech is a leading global provider of advanced semiconductor manufacturing equipment, specializing in wafer/Panel wet processing, bonding, debonding, and cleaning technologies. With a strong commitment to innovation and quality, Scientech partners with semiconductor manufacturers worldwide to enable the next generation of electronic devices.
    About PulseForge
    PulseForge, Inc. develops and manufactures state-of-the-art flash lamp-based tools that deliver energy in a precise and targeted manner to enable innovation in industrial manufacturing. Our expertise and tools empower our customers to explore novel materials and manufacturing methodologies, driving dynamic and efficient production at an industrial scale.
    For More Information
    Contact:
    Kiran Kesavan日山
    Sales Manager, (Scientech)
    Mobile: +886-965-706-150
    Vikram Turkani
    Director, Technology Partnerships and Strategic Business Development (PulseForge)
    Mobile: +1 269-743-8168
  • Wafer warpage is a critical challenge in advanced semiconductor processes, particularly with thin wafers, heterogeneous integration. Warpage can lead to misalignment, transfer failures, and significant yield loss. To tackle these challenges, Scientech together with AMC has developed an integrated solution tailored to modern manufacturing demands.
    Challenges We Address:
    ⦁ Warpage resulting from wafer thinning, thermal stress, or material mismatches
    ⦁ Alignment errors during photolithography and bonding steps
    ⦁ Mechanical stress or breakage during wafer handling and chucking.
    Our warpage handling system combines mechanical innovation, intelligent automation, and optimized process controls. The solution ensures stable performance and high yield, even with warped wafers. Designed for both 12-inch and panel, it supports key process modules in the process line.
    This solution is ideally suited for semiconductor fabs involved in:
    ⦁ 2.5D/3D integration
    ⦁ Panel-Level Packaging (PLP)
    ⦁ Fan-Out Wafer-Level Packaging (FOWLP)
    ⦁ Advanced interposer technologies
    Our system is built around a proven lamination platform that withstands high temperatures, various concentrated chemicals, and ultra-low vacuum conditions to effectively minimize warpage and stabilize the substrate. This approach has been verified and approved by leading global semiconductor companies.
    To learn more or discuss a customized configuration, please reach out to our technical team.
    About Scientech
    Scientech is a leading global provider of advanced semiconductor manufacturing equipment, specializing in wafer/Panel wet processing, bonding, debonding, and cleaning technologies. With a strong commitment to innovation and quality, Scientech partners with semiconductor manufacturers worldwide to enable the next generation of electronic devices.
    About AMC
    AMC (Alliance Material Co., Ltd.) provides materials and services for semiconductor packaging, testing, and wafer processing. AMC provides high-quality adhesive and insulation films for the semiconductor, optoelectronics, and precision manufacturing industries. Their main products include back-grinding tapes, dicing tapes, die-attach films, and protective films used in advanced semiconductor processes. AMC helps manufacturers improve process reliability and yield with practical, reliable material solutions.
    For More Information
    Contact:
    Kiran Kesavan日山
    Sales Manager, (Scientech)
    Mobile: +886-965-706-150

  Products

  • Wafer Reclaim
    We offer wafer reclaim service for 12" Si Wafer and 6" SiC wafer....

    • Scientech offers advanced wafer reclaim services with full process optimization and cutting-edge clean technology. Their process achieves 19nm particle removal and ultra-low trace metal contamination (<1E9). For 12” silicon wafers, Scientech handles both Cu and Non-Cu processes with annual capacity of 160,000 wafers, supported by advanced defect inspection tools (SP1, SP2, SP5). They also provide grinding, polishing, and reclaim services for 6” SiC wafers at a capacity of 1,000 wafers per month, delivering super flatness (GBIR < 0.5mm) and complete polishing options, including single-side, double-side, and final haze polish. 
  • Equipment Design and Manufacturing
    We offer wet processing equipment and temporary Bonding-Debonding Solutions....

    • 1. Wet Process - Bench

    This wet bench system is designed for semiconductor applications including front-end-of-line (FEOL), back-end-of-line (BEOL), compound semiconductors, and advanced packaging or bumping. It supports both cassette and cassette-less configurations and is trusted by major international companies for its integration of leading-edge technologies. The system enables a wide range of chemical processes such as etching for metal, oxide, and nitride removal; stripping of photoresist (PR) and polyimide (PI); polymer removal; pre- and post-process wafer cleaning including flux removal; and electroless plating of materials such as zinc (Zn), nickel (Ni), palladium (Pd), and gold (Au).

    2. Wet Process - Single Wafer 

    This single wafer wet process system serves back-end-of-line (BEOL), compound semiconductor, and advanced packaging or bumping applications. It combines soak/immersion with single-wafer processing to deliver high-performance results. This system utilizes advanced technology to carry out processes such as under-bump metallurgy (UBM) and metal etching, flux cleaning using hot deionized water (DIW), photoresist stripping, wafer cleaning with advanced process control (APC) and soft spray methods, as well as final cleaning for wafers, masks, and frames.

    3. Temporary Bonding& Debonding

    Engineered for IGBT and SiC power device fabrication and advanced semiconductor packaging, this system supports temporary bonding and de-bonding processes. It is widely adopted by major international companies for its precision and advanced capabilities. Key processes include temporary bonding, temporary de-bonding, release layer formation, and carrier (glass) recycling, enabling a reliable and efficient solution for handling fragile wafers during packaging and processing. 

  • Representative
    Our representative product line includes Lithography, Etch, Thin Film, Diffusion, Metrology, Sub-System, Package& Material and Repair& Refurbish....

    • Our representative product brands include : 

    Lithography: Vistec, SMEE, Kingsemi, Ushio

    Etch: Plasma-Therm, Trymax, Corial, and more

    Thin Film: ClassOne Technology, ProOptics, Intlvac Thin Film, and more

    Diffusion: HPSP

    Metrology: KLA, Filmetrics, VLSI Standards, Toray, Suruga Seiki, and more

    Sub-Systems: Advanced Energy, MDC Precision, Youibot, and more

    Package & Material: Mirtec, Sanyo Seiko, PacTech, Tech in Spirit, and more

    Repair and Refurbish: Dynatronix, Genmark, Kensington

Categories

1 FLEX
  • Advanced Packaging
  • Components & Devices
  • Inspection & Test
  • Tools & Equipment
    • 100 Electronic System Design
  • Packaging Services
  • Test Tools and Services
    • 200 Packaging and Assembly Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Wafer Level Bonders
  • Wafer Mount; Taping Equipment
    • 204 MEMS Equipment
  • Wafer Level Bonders
    • 207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
    • 308 Substrates
  • Compound Semi substrates (GaAs; GaN; InP; SiGe, etc.)
  • SOI; Silicon on Sapphire (SOS); Silicon Carbide
  • Test; Monitor Wafers; Reclaim or Virgin

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