All EtroX® products are suitable for machining high-precision test sockets with extremely small boreholes. These have a minimum diameter of 0.1 mm and are very well formed with minimal burr formation. These materials offer very high flexural modulus, high or excellent hardness, low water absorption, low residual stress, high dimensional stability, and excellent machinability.
EtroX® V (proprietary ceramic-filled PEEK) was developed for the high demands of the semiconductor industry and increases the reliability and economic efficiency of time-consuming and cost-intensive production of equipment for testing electronic components.
EtroX® I CM (Polyimide) is a premium material specially developed to meet the high demands of the semiconductor industry. As a pure polyimide, it withstands particularly high temperatures. This material can be used to design components that offer significant advantages over other thermoplastics.
EtroX® I CM UHT (Ultra-High Temperature Polyimide) offers the same exceptional characteristics of EtroX® I CM and additional temperature resilience, maintaining its mechanical properties at continuous operating temperatures up to 300°C.
Learn more about EtroX® materials and our lineup of products for the semiconductor industry here.
Stop by Booth #2084 to see samples of EtroX® V, I CM, and UHT, and to explore how Roechling materials can help power your next semiconductor project.