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MDI Advanced systems USA inc.

San Diego,  CA 
United States
https://www.mitsuboshidiamond.com/eng/
  • Booth: 7422

No kerf loss, Higher TP & Die Strength-SnB is a game-changer

Overview

We are a subsidiary of Mitsuboshi Diamond Industrial CO., Ltd. Since its founding in 1935, MDI has continuously refined its processing technologies for brittle materials. Moving forward, we will continue our research and development with a focus on the future, striving to deliver truly valuable products to our customers. We provide chip fabrication solutions for semiconductor wafers, focusing on power semiconductors (SiC/GaN/GaAs/Sapphire) and next-generation semiconductors (glass). We can provide demonstrations, sample preparation, and support for customers in North America.

  Press Releases

  • In 2025, Our parent company Mitsuboshi Diamond Industrial Co., Ltd. celebrates its 90th anniversary. To commemorate this milestone, we have launched a special website: https://www.mitsuboshidiamond.com/90th/.(Japanese only).

    Since our founding in 1935, we have contributed to improving our customers’ production efficiency and product quality through our precision processing technologies. We have diligently supported the growth and success of our customers’ businesses over the years. Moving forward, we remain committed to addressing diverse needs and challenges by delivering optimal solutions.

    The special website reflects on 90 years of progress, showcasing our history of challenges and innovations. It also features interviews with our employees, offering insights into the passion and dedication we bring to delivering value to our customers.

    We promise to continue being a trusted partner, working together with our customers to create new value and pave the way for the future. We invite you to visit our special website and explore the history and aspirations of Mitsuboshi Diamond Industrial Co., Ltd.

    Special Website URL
    https://www.mitsuboshidiamond.com/90th/
    (Japanese only).

  Products

  • DIALOGIC DS/DB Series
    No Chipping/No Kerf Loss/High Productivity/Dry Process/ Standalone system that integrates the singulation process of semiconductor wafers into a compact body- DS Series(Scribe Unit) DB Series(Break Unit)...

    • The SnB Method is MDI's original technology for the singulation process of leading edge semiconductor devices. It solves many issues found in conventional process method and enables high productivity, high accuracy, low cost, and enviormentally -friendly semiconductor device manufacturing, 
  • DIALOGIC DL Series
    【All-in-One】2021 Good Design Award- All in one fully automated system that integrates the singulation process of semiconductor wafers into a compact body. No Chipping/No Kerf Loss/High Productivity/Dry Process...

    • All-in-One Machine- Integrated Scribe and Break process with fully automated system
    • Smal Footprint- Reduce footprint by 70%
    • Eco-friendly- No water is used since it is dry process

    It solves many issues in the conventional process method and realizes high productivity, high accuracy, low cost and enviromentally-freindly semiconductor device manufacrturing. 

Categories

1 FLEX
  • Processing & Manufacturing
  • Substrates
  • Tools & Equipment
    • 200 Packaging and Assembly Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Wafer Mount; Taping Equipment
    • 202 Other Equipment
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 300 Packaging and Assembly Materials
  • Scribe Tools; Saw or Dicing Blades and Accessories
    • 308 Substrates
  • Compound Semi substrates (GaAs; GaN; InP; SiGe, etc.)
  • Gallium Arsenide (GaAs); Sapphire Substrates
  • Prime; Polished; Mirrored Wafers
    • 900 Support Products
  • Tools

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