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Global Zeus

Hwasung-si, Gyeonggi-do,  Korea (South)
http://www.globalzeus.com
  • Booth: 1855

Leading Provider of Wet Process Equipment

Overview

Founded in 1970 in the Republic of Korea, Global Zeus is a leading manufacturer and total solutions provider in our served markets, with a diverse product portfolio serving the semiconductor, display, and photovoltaic industries worldwide. Our agile and adaptive approach to major industry trends allows us to anticipate and respond to customers' requirements, enabling us to provide advanced solutions for wet process, heat treatment, automation backed by decades of technical expertise. Our deep experience with top-tier semiconductor fabs has refined our ability to deliver high-quality equipment with exceptional lead times and compelling cost of ownership. We have become the partner of choice for major semiconductor fabs in critical areas like advanced packaging technology, allowing us to collaborate with our customers to solve some their most difficult challenges, from diverse wet chemical process solutions to integrated manufacturing support. Driven by enthusiasm, relentless effort, and a commitment to excellence, Global Zeus continues to advance technology for a smarter, more connected world.

  Products

  • Film Framed Wafer Cleaner (ATOM)
    Global ZEUS ATOM is a 300mm film framed wafer cleaner configurable with up to 4 chambers for enhanced performance. It has been proved in HVM for advanced semiconductor packaging like HBM, 2.5D, Fan-Out....

    • 1) Features
       • Excellent sealability to protect metal frame
       • Intelligent vision inspection to prevent wafer breakage
       • Continuous process monitoring to avoid process errors
       • Auto cup cleaning for less maintenance
       • Chip and wafer alignment including warped (≤ 3mm) and thin (≥ 20um)

    2) Applications
       • Debond cleaning
       • Metal etching
       • Post-saw cleaning
       • Flux cleaning
       • PR stripping

  • Temporary Bonder (PIO-3B)
    Global ZEUS PIO-3B is a 300mm temporary bonder offering precise bonding with top and bottom alignment and real-time inspection. Its compact heater and auto cup cleaning enhance process efficiency and uptime....

    • 1) Features
       • Smaller footprint (17.26m2) with a compact heater
       • Advanced real-time inspection
         - TTV ≤ 3㎛, void-free bonding, ±30㎛ alignment accuracy
       • Top & Bottom alignment with bonding accuracy ≤ 50um
       • Auto cup cleaning for less maintenance
       • Baking up to 250°C with ±1 uniformity
       • Modular design for customized configurations

    2) Applications
       • Temporary bonding

  • Photonic Debonder (PIO-3D)
    Global ZEUS PIO-3D is a 400mm photonic debonder offering a faster debonding process with significantly reduced thermal stress, making it an essential solution for advanced packaging applications where thermal sensitivity is critical....

    • 1) Features
        • Faster, lower stress debonding
        • Higher throughput over 50 WPH
          - Larger beam area (75x150 mm2) with uniform energy distribution
        • Free from thermal stress
          - Energy targets only the adhesive layer
        • Lower Cost of Ownership
          - Carrier reusable up to 15 times
          - Debonding without a release layer
        • Compatible with film and glue bonding materials
        • Processes film framed wafers and 300mm wafers

    2) Applications
        • Debonding

Categories

207 Process Equipment
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Etching; Stripping; Ashing - Dry and Wet Equipment
    • 301 Chemicals & Solids
  • Acids; Etchants
  • Cleaning Chemicals; Solvents; Strippers
  • Other Specialty Chemicals
    • 902 Other
  • Other

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