The Die, Wire-bond, Packaging & Semicon Inspection Experts.
Overview
Machine Vision Products, Inc., will be demonstrating its Hybrid Die Wire Metrology systems, Packaging Inspection, Wafer Inspection and Semiconductor Automated Optical Inspection solutions at the Semicon West exhibition.
MVPs Aura, Aurora, 900, 2030 and Versa systems deploy a diverse inspection toolbox providing the highest quality inspection and metrology capabilities for multiple locations in microelectronics and packaging lines.
With specialized material handling and tools MVP can provide some of the fastest UPH's in the industry.
The high speed, high inspection quality solution provided by MVP puts it as a leader in these markets, that was, until recently, very dependent on manual inspection
MVP continues to lead the global inspection arena by developing all of their product offerings. With over 30 years of leadership, MVP is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally. For additional information on this unique solution, please visit us at www.machinevisionproducts.com or visit us at Booth 5578