Overview
Partow Technologies provides room-temperature wafer bonding equipment and services. The company provides wafer bonding equipment for up to 100mm substrates based on atomic diffusion bonding method.
- The room temperature bonding allows to bond materials with different thermal expansion coefficients since no heating is required. No thermal strain on the bonded wafers.
- Bond strength is greater than bonded materials
- The only requirement for wafers is a polished surface
- Semiconductor, oxides, metals .... can bond to form functional devices
Example bonded materials: Silicon, Lithium Niobate, Lithium Tantalate, LYSO, Quartz, GaAs, InP, Saphire ...
The bonding is performed in ultra-high vacuum (UHV) chamber. The wafer surfaces are plasma activated and are bonded inside the ultra-high vacuum chamber.