Visit booth #1952 for the latest in oxide removal.
Overview
Plasmatreat’s Openair‑Plasma® and REDOX® technologies transform semiconductor manufacturing with powerful, inline plasma surface treatment—no vacuum, no solvents. From wafer cleaning to die and wire bonding, our systems deliver ultra-fine cleaning, oxide reduction, and surface activation at high speed and low cost.
We improve adhesion, solderability, and reliability while reducing defects and cycle time. REDOX® enables inline, flux-free oxide removal with N₂/H₂ plasma—perfect for power modules and sensitive devices. All treatments are potential-free (<1 V) and fully integrable into your existing production line.
See how we’re enabling next-gen packaging, higher yields, and cleaner, more efficient production—visit us at Booth 1944!