Welcome! We are a leading company in advanced packaging.
Overview
With the relentless pursuit of miniaturization and enhanced functionality, advanced packaging has emerged as a key enabler of cutting-edge technologies such as Internet of Things (IoT), artificial intelligence (AI), autonomous vehicles, and 5G telecommunications. It enables the realization of complex system-on-chip (SoC) designs, heterogeneous integration of various chip types, and the integration of diverse functionalities within a single package. Shibuya has been serving the back end packaging industry for more than 40 years.
Our line up includes, solder ball mounter that can place wide range of solder balls including micro balls, high precision flip chip bonders that can bond at submicron levels, and LED / IC taping and handler machinees. We specializes in customizing our machinies to meet your R&D or mass production needs.