Welcome to TDK, leaders in factory automation equipment!
Overview
AFM 15 Flip Chip Gold to Gold Interconnect Die Bonder:
TDK AFM with horn capability for an even smaller die size of 80mm(sq) up to 20mm (sq). Features die attachment process is a clean, lead-free, precision back-end assembly process with low cost of ownership and high productivity.
TDK Tape Frame Load Port
Features industry-leading particle reduction performance by airflow control, simple, reliable, and lightweight design. Pods applicable to 300 mm Tape Frame (SEMI G74) pods with FOUP/Placement detection and frame protrusion detection sensor
TDK TAS PLP Load Port for FO-PLP Panel Level Packaging
The PLP load port incorporates SEMI Standard 450 table design with TDK’s fab leading cleanliness standard. This load port can handle panel sizes of 500mm ~650mm with optional N2 purge, panel mapping, and ethernet.
TDK 200mm SMIF Loader and Open Cassette Loader for Expanding Fab Growth:
Addresses 200mm fab requirements for low operational costs, and cleanliness. Uses a 300mm bolts interface to allow installation using current EFEM design. TDK 200mm SMIF and 200mm Open Cassette design uses a base 300mm load port and 300mm tool software interface.