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Overview
Fabrication & Packaging Electroplating Chemistries for Advanced Semiconductor Applications
Technic’s semiconductor fabrication and packaging electroplating chemistries, marketed under the name Elevate®, are well respected for innovation and high quality. Elevate® processes offer high performing electroplating chemistries for copper, nickel, tin, and precious metals. In addition, Technic supplies photoresist strippers (TechniStrip®) for liquid and dryfilm resist as well as metal etchants (TechniEtch) and cleaners (TechniClean) for a variety of substrates.
Technic products provide a number of specific attributes that allow semiconductor manufacturers to remove many process limitations and take their technology to a new level. Our semiconductor fabrication and packaging chemistries are widely used in several advanced packaging platforms including FOWLP (Fan-Out Wafer Level Packaging), Fan-In WLP, Flip Chip, and 2.5/3D.