Best solution on dicing blades, chucks and grinding wheels.
Overview
Founded in 1958, ZZSM is the unique R&D unit for the abrasive industry in China.
As the biggest professional leader in this specific area, our main products are dicing blades, singulation blades, chuck tables and other relative products in dicing and singulation application.
For dicing process, dicing blades for wafers, singulation blades for BGA,QFN, DFN, ceramic substrate, glass and so on can have excellent quality.
For grinding process, our back grinding wheels for silicon wafer, SiC wafers and sapphire, edge grinding wheels, notch wheels and so on will help cost down with best life and grinding quality.
Chuck tables, flanges and wheel mounts, UV tape, dressing boards can provide best solution for you. Fine pore ceramic chuck table has good flatness and parallelism. Size from 2", 4", 6", 8 ",12", max 500mm, round/rectangular and other special shapes are available.
Monocrystalline and Polycrystalline MPCVD for optical, thermal conductivity, cooper diamond composite is available.