Teltec Semiconductor Pacific Limited

Sonix began business in 1986 in Springfield, Virginia. Sonix has been the technology leader for the advanced scanning acoustic microscopy used in packaged semiconductor and wafer inspection services. We were the first to introduce PC-based digital imaging solutions, and since our founding we have consistently led the way with innovations that support continuous improvement in our customers' products and processes.

SONIX™ systems are used for the non-destructive inspection of a variety of materials including semiconductor packages, automotive parts and other advanced components. Based on proprietary softwares, hardwares and patented innovations, Sonix's systems have evolved over many years of experience working with customers.  Sonix strives to provide the most accurate data, the perfect image quality, exceptional maneuverability and high reliability of the equipment, so as to improve the efficiency and cost effective.

AutoWafer Pro™

A flexible, automated wafer inspection system designed for production, AutoWafer Pro provides fast, high-resolution scanning of 200mm and 300mm bonded wafers. It’s the ideal ultrasonic equipment for identifying bond defects in wafer applications such as MEMS, BSI Sensors, CMOS, memory, TSV and LED.

With extensive analysis capabilities at both the wafer and device level, there’s no need to reload and rescan wafers to get all the diagnostic images you need. And with high-speed scanning managed by fully automated wafer handling, AutoWafer Pro supports 100% nondestructive testing (NDT) for improved yields and a faster time to market.

• The ideal ultrasonic equipment for detecting wafer-to-wafer bonding defects
• A fully automated, production-ready wafer inspection system for MEMS, CMOS, BSI sensors, memory, TSV, LED and other applications employing wafers 200mm and smaller
• Provides wafer map with die-level pass/fail indicators (optional)
• Provides analysis (optional)
• 200mm SECS/GEM
• TSV entrenched metrology
• Fast, high-resolution scanning of 200mm and 300mm wafers for production environments
• Fully automated robotics using open cassettes, SMIF Pod, FOUPs or FOSB handling
• Class 1 clean room compliant, with integrated HEPA filter
• 300mm SECS/GEM (optional)
• KLARF compatible (optional)

ECHO-VS™

To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.

• Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
• Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
• Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
• Waveform averaging for improved signal-to-noise ratio
• Wide range of transducers from very low to ultra high frequency
• Stacked Die Imaging (SDI) (optional)
• Molded Flip Chip Imaging (MFCI)

ECHO-LS™

The ECHO provides non-destructive scanning acoustic microscopy to simplify testing, increase yield and maximize productivity in the lab or on the production floor.

A robust, universal, inspection tool for overmolded single-die packages, bare flip chips and other standard applications

• Imaging of defects as small as 5 microns
• Transducers from 15MHz through 300MHz, designed and matched in-house to address all types of applications and materials
• Stacked Die Imaging (SDI) (optional)
• Molded Flip Chip Imaging (MFCI) (optional)

Ultra-sound Scanning Mode：A-Scan, B-Scan, C-Scan, Multi-scan, Tray-scan,Jump-scan, HTS, Tami-Scan

Max. resolution：10000 x 10000 pix

Max. scan area：350mm x 350mm

Max. serve velocity：1000 mm/s, 10000 mm/s2

Transducer frequency range：100 to 300 MHz

System dimension：31" x 31" x 48" (W x D x H）

Akrometrix AXP3

Shadow Moiré Technology
Shadow Moiré is a non contact, full field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. It requires a Ronchi-ruled grating, a white line light source at approximately 45℃ to the grating and a camera perpendicular to the grating. Its optical configuration integrated with the heating chamber is shown in the figure to the right.

The new generation of surface measurement and analysis techniques
Development/Diagnostics /Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction.Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I & level II assembly yields and enhance product reliability. Below data could be measured: Coplanarity, Sign warpage, Fulfill warpage, Twist, Bow, CTE, etc.

TherMoiré AXP3 Feartures:
• Capable of up to 400mm x 400mm samples
• Minimum Feature Size: 2mm x 2mm
• Up to 1.7 million data points per Acquisition in 2 seconds
• Warpage resolution down to 0.5µm（300 LPI Grating）
• 2 zone temperature control on bottom, plus top heater on separate control loop
• Temperature range of -55°C to 350°C
• Maximum Heating Rate, 50°C to 250°C, 3.5ºC/s
• Maximum Cooling Rate, 250°C to 125°C, 2.25ºC/s
• Can integrate DFP and DIC technology
Automation
• Exhaust Speed is Software Controlled
• Larger Touch Screen HMI for Machine Control
• Shadow Moire Lens Automation
• Front Door Locking System
• New PLC Control System with Improved Thermocouple Control and Response
• The AXP3 camera field of view can be freely set in the software, increasing the flexibility of use

Top/Bottom Heating Chamber
In addition to the above features for AXP3 adds up and down two heating zones, with the following features:

• Top and Bottom Heating Capacity with Top/Bottom/Lateral Uniformity <±5ºC
• Capable to measure unpainted surface
• Dual CoolBoost from Front and Back and Triple Exhaust Channel from Left, Right and Bottom creating faster and uniform cooling effect.

Digital Fringe Projection - DFP Module
New Standalone Product that provides pure convection heating for assembly reflow simulation
Application - Solder ball coplanarity measurement, discontinuous surface & socket measurement

• Enables step height and discontinuous surface measurement
• FOV can be moved to anywhere on the sample (gantry fixture)
• Improved top/bottom temperature uniformity – no grating
• High X/Y resolution for solder ball coplanarity measurement

Digital Image Correlation - DIC CTE Module
• Add-on module : AXP3 & PS600S & PS200S
• Strain and CTE measurement module
• Data acquisition time < 1 second
• In-Plane Resolution: <1 μm
• Strain Resolution: <100 microstrain (Δ L/L x 10-6)
• Temperature Range: -55°C to 350°C
• Field of View: 115mm x 150mm

Convective Module – CM
• Optional Sub Room Temperature Module fits inside the AXP
• Accommodates samples up to 200mmx200mm
• Heats and cools from -55 C to 300C
• Automatically controlled by StudioSurface Measurement
• Adjustable heating, cooling and airflow rates

Convective Reflow Emulation Module - CRE
Combines maximum resolution capabilities of the AXP with improved temperature uniformity
• Most accurately emulate production reflow conditions for semiconductor packages
• + 3.0 °C/sec heating rate
• Sample temperature uniformity +/- 2 °C
•  70 mm diameter circular field of view

Akrometrix Studio 9.0
Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system, Studio powers a set of modular metrology solutions that generate fast, comprehensive surface information characterizing a wide range of microelectronic components and assemblies. Studio enables the user to draw conclusions and make decisions using a variety of powerful graphical and analytical analyses.

Studio 9.0 Key Features：
• RTA Included
• New Product Support
• New Gauges
• New Surface Measurement & Thermal Profiler
• New Surface Analysis Features
• + more minor feature additions and bug fixes

New Gauges :
Max Warpage Gradient (MWG): Quantifies the highest slope area of the data set by looking at height change in a small area around each data point. Primarily useful for comparison of data sets. Only a single highest value is reported.

Average Phase Amplitude (APA): Measurement quality metric showing the average amplitude of the phase curve calculated for each point in the data set. Higher values indicate better overall measurement resolution. This same math is used in phase amplitude thresholding where lower values are masked from the data set.

Average Phase Modulation (APM): Similar measurement quality metric as APA normalized across the dynamic light range of the image. Higher is still better, with values approach 1 in best case.

Real Time Analysis (RTA) ifor Studio Software

• Enables user-defined ‘Pass/Fail’ limits applied to measurement results
• Visual Pass/Fail indicators immediately after measurement
• Works with Part Tracking for Multiple Part Testing
• Works at Room Temperature and During Thermal Profile
Combines High Volume Testing with Go/No Go Criteria