ACCURACY, Help Your PICK&PLACE Accurate, Efficient, Smart.
Overview
ACCURACY, headquartered in Suzhou, China, is a leading provider of pick&place equipment for the semiconductor industry.
Specializing in micro-assembly for 14 years, we provide new-generation semiconductor materials and advanced package technologies by offering the latest semiconductor die bonder, such as Multi-Chip Die Bonder, Chip to Wafer Hybrid Bonder and Silver Sintering bonder., and providing solutions for customers in advanced packaging, IC packaging, power devices, optoelectronics and sensors.
Products