HEF熙科品牌划片刀,经过数年研发,已做到:
主要性能指标与DISCO/K&S--对应。
金刚石与DISCO一样也为五个浓度,11个颗粒细分
最薄刀刃可以做到13um。
已顺利实现在硬刀领域的大批量切割应用。
After several years ofdevelopment,HEF dicing blade has been achieved.
The main performance indicators correspond one-to-one with DlSCO/K&S.
Diamond, like DiSCO, has 5 concentrations and 11 particle subdivisions.
The thinnest blade can reach 13um.
Successfullyachieved large-scale cutting applications in the hard knife field.