Dongguan HEF Mechanical Electrical Equipment Co.,Ltd

Dongguan,  Guangdong 
China
http://www.dghef.com
  • Booth: T0443

划片刀及切割服务! HEF dicing saw blade and cutting sevice!

Overview

HEF dicing saw blade series, dicing saw services and cutting plan, wafer cleaner, cleaning machine, taping machine, UV machine, spindle, professional finishing Disco, auxiliary consumables product series like UV tape and dicing machine special working plate, frame, waterproof curtain and cassette, etc. 

Chip innovation,anything is possible.HEF technology makes your cutting process smooth and efficient!


  Press Releases

  • HEF熙科品牌划片刀,经过数年研发,已做到:
    主要性能指标与DISCO/K&S--对应。
    金刚石与DISCO一样也为五个浓度,11个颗粒细分
    最薄刀刃可以做到13um。
    已顺利实现在硬刀领域的大批量切割应用。

    After several years ofdevelopment,HEF dicing blade has been achieved.
    The main performance indicators correspond one-to-one with DlSCO/K&S.
    Diamond, like DiSCO, has 5 concentrations and 11 particle subdivisions.
    The thinnest blade can reach 13um.
    Successfullyachieved large-scale cutting applications in the hard knife field.


  Products

  • 划片刀 Dicing saw blade
    金属硬刀,树脂刀、磨刀板、法兰等,应用于晶圆、MOS管、IC、DFD、QFN、碳化硅等材料 Dicing saw balde , Resin dicing saw blade, Dressing Plate, Flange, which apply to wafer, MOS, IS, DFD, QDN and SIC and so on....

  • HEF熙科品牌划片刀,经过数年研发,已做到:
    主要性能指标与DISCO/K&S--对应。
    金刚石与DISCO一样也为五个浓度,11个颗粒细分
    最薄刀刃可以做到13um。
    已顺利实现在硬刀领域的大批量切割应用。

    After several years ofdevelopment,HEF dicing blade has been achieved.
    The main performance indicators correspond one-to-one with DlSCO/K&S.
    Diamond, like DiSCO, has 5 concentrations and 11 particle subdivisions.
    The thinnest blade can reach 13um.
    Successfullyachieved large-scale cutting applications in the hard knife field.