Suzhou Bozhon Semiconductor Co.,Ltd

Suzhou,  Jiangsu 
China
http://www.boemi.com
  • Booth: 5425

Welcome to our booth,we are focus on die bonding&inspection.

Overview

Suzhou Bozhon Semiconductor Co., Ltd. is a wholly-owned subsidiary of Bozhon Precision Technology Co., Ltd. (stock code: 688097), relying on Bozhon Precision Technology's more than 20 years of technological accumulation and focusing on semiconductors. And through industry university research cooperation with well-known domestic universities such as Tsinghua University and Harbin Institute of Technology, we provide high-precision, high-speed, and stable semiconductor mounting equipment that meets advanced packaging requirements for customers in fields such as AI and optical communication, as well as efficient chip AOI inspection equipment.

Bozhon Semiconductor provides micro-assembly of opto-electronic devices and IC chip inspection solutions. Regardless of the device material and target application, these solutions are cutting-edge, high-precision production systems utilizing advanced automation methods. Additionally, our modular system architecture is scalable so that it can meet exploratory, process validation development, and high-volume production requirements - and anything in between.


  Products

  • CesiStar—AOI Inspection Machine
    Bozhon Semiconductor CeciStar Series AOI Inspection machine provides high performance, fully automated optical inspectionof packaged integrated circuit(IC) components....

  • The CeciStar Series AOI Inspection machine provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.

    High precision:3D measurement accuracy 5 microns

    High Throughput:UPH up to 40k

    High adaptability:Compatible with various chip packaging forms

    Easy to expand:Fast changeover time