The CeciStar Series AOI Inspection machine provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.
High precision:3D measurement accuracy 5 microns
High Throughput:UPH up to 40k
High adaptability:Compatible with various chip packaging forms
Easy to expand:Fast changeover time