ASMADE (SHENZHEN) TECHNOLOGY LIMITED, a national high-tech enterprise founded by international leading motion control expert team, gathered the industry's top semiconductor packaging technology experts, focusing on the research and development of high-precision semiconductor equipment, manufacturing and sales.The main machines are FOWLP Die Bonder, Advanced packaging equipment, Clip Bonding Line, power device packaging equipment, Mini LED COB Die Bonder, intelligent control equipment and semiconductor packaging process management system. Dedicated to providing one-stop semiconductor packaging process die bond solutions. The machines have independent intellectual property rights.
At the SEMICON CHINA 2025 exhibition, we will be showcasing the High-Precision Semiconductor Die Bonder, the Epoxy Die Bonder, and the Pixel Die Bonder.
In the semiconductor packaging field, we introduce the High-Precision Semiconductor Die Bonder and Epoxy Die Bonder.
The High-Precision Semiconductor Die Bonder is a semiconductor die bonder that achieves both high precision and high efficiency. It features a turret transport structure, supports micro and sub-micro tables, and is equipped with Artificial Intelligence-based precision auto-compensation and pressure correction functions. In turret transport mechanism, up look cameras and transfer tables are strategically positioned across multiple stations to enable real-time deviation correction and accuracy assurance. The turret structure allows for simultaneous pickup, placement and compensation photography, finishing multiple processes at same time. Compatible with diverse product requirements, it supports both single-material packaging and multi-material integrated packaging. The High-Precision Semiconductor Die Bonder has strong material compatibility and it supports waffle pack, GELPAK, 2,4,6,8,10,12-inch wafer, six wafers of 6-inch, four wafers of 8-inch, etc.
The Epoxy Die Bonder is equipped with up to four spot epoxy mechanisms. This system structurally integrates both spot epoxy and die bond processes, enabling multifunctional operation within a single machine to deliver optimized solutions for manufacturers.The machine achieves positional accuracy of <±15μm and angular accuracy of <1°, featuring vision-assisted spot epoxy position recognition with support for predefined patterns and custom mapping importation for epoxy application. It supports 2,4,6,812-,inch wafer,etc.
In the Mini LED packaging field, we provide the Pixel Die Bonder, which is high-precision flip-chip die bonder, refines Mini LED direct-display packaging through its pixel die bonding technology. It is capable of 36-wafer ring mixed bonding. Featuring patented pixel die bonding capability, it achieves one time locating for RGB 3 colour die bonding within one pixel - an industry first. This innovation enhances die bond speed, ensuring exceptional display uniformity.
Welcome to visit Booth E6 #6179 for our semiconductor packaging die bond solutions.