DR Laser Singapore Pte Ltd

Singapore,  Singapore 
Singapore
https://www.drlaser.com.cn/en/index.aspx
  • Booth: 2753

Your trusted partner in high precision laser solutions

Overview

DR Laser is a supplier of high-precision laser processing equipment for Semiconductor, Advanced Display and Photovoltaic industry. Our corporate headquarter is located at the heart of Optics Valley in Wuhan, China.

Since 2008, we have worked closely with end customers to develop various industry pioneering laser-based production equipment. By leveraging our know-how and supply chain, we were able to ship more than 7,000 machines with key laser technologies to customers across 16 countries. This success prompted our company to become a public listed company in 2019 (stock code: 300776.SZ). Today, we have built ourselves a multinational corporation with more than 1,000 employees worldwide, an overseas R&D center in Israel, and a direct subsidiary in Singapore, earning more than USD200million in corporate annual revenue. 

With our sight set on advanced laser applications, we are offering products and services for:

               1) Through glass via (TGV) microfabrication;

               2) Laser-based wafer dicing solutions;

               3) Laser-Assisted Bonding (LAB).

DR Laser is committed to overcome real world manufacturing challenges though innovative laser solutions.

Sales Director :Zhang Tao

Email:[email protected]

Phone:+86 13971261924 


  Products

  • Through-Glass Via (TGV) Micromachining - Laser
    DR Laser manufactures high-precision processing equipment for the microfabrication of via holes on glass substrates. The LA-series is designed for laser modification of various glass material to prepare for subsequent wet etching process....

  • Our product utilizes Laser Accelerated Controlled Etching (LACE) technology to create large numbers of through-holes on glass substrates, that will undergo coating and metallization to achieve electrical conductivity between the top and bottom layers, which can be used in semiconductor and electronics packaging.

    LACE is a subtractive fabrication technique which consists of two-steps: laser modification, followed by wet chemical etching. During the modification process, ultrafast laser is employed to induce phase changes in selective regions of the glass material. In subsequent chemical etching process, these phase-changed regions exhibit high etching efficiencies which leads to the formation of through-holes that are crack-free.
  • Through-Glass Via (TGV) Micromachining - Wet etch
    DR Laser manufactures high-precision processing equipment for the microfabrication of via holes on glass substrates. The CE-series is designed for wet etching of various glass material after laser modification process....

  • Our product utilizes Laser Accelerated Controlled Etching (LACE) technology to create large numbers of through-holes on glass substrates, that will undergo coating and metallization to achieve electrical conductivity between the top and bottom layers, which can be used in semiconductor and electronics packaging.


    LACE is a subtractive fabrication technique which consists of two-steps: laser modification, followed by wet chemical etching. During modification process, ultrafast laser is employed to induce phase changes in selective regions of the glass material. In subsequent chemical etching process, these phase-changed regions exhibit high etching efficiencies which leads to the formation of through-holes.

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