Hefei Accuracy Intelligent Equipment Co., Ltd

合肥市,  安徽省 
China
  • Booth: 5429

Overview

Accuracy is a professional high-end equipment manufacturing company specializing in the research and development, production, sales, and service integration of ultra-precision grinding equipment for the pan-semiconductor industry. The core team consists of professors and doctors from Hunan University and Xiangtan University, as well as senior industry experts. The company's headquarters is located in Hefei, with a research and development center in Changsha, and offices in Shenzhen, Dongguan, Xiamen, Wuzhou, Chengdu, Shanghai, and other places. The company has developed semi-automatic and fully automatic series precision dicing machines for 6-12 inches, which are widely used in the packaging process of integrated circuits, optoelectronic devices, discrete devices, sensors, and other products. The equipment can cut various brittle materials and composite materials including wafers, ceramics, LEDs, PCBs, etc. The company always provides customers with innovative products, reasonable solutions, and efficient and intimate after-sales service, including dicing equipment, processes, and tools, to provide overall solutions, allowing customers to maintain competitiveness continuously.

  Products

  • ф6 inch Semi-automatic Precision Dicing Saw
    A new upgraded high-precision,high-performance 6-inch semi-automaticprecision dicing saw...

    • A new upgraded high-precision,high-performance 6-inch semi-automatic precision dicing saw, equipped with high-precision and high-rigidity DC spindle,high-precision lead screw guide rail,Y-axis grating + servo motor full closed loop system,can provide customers with high efficiency, high quality, cost-effective cutting overall solution.

    Product Characteristics
    High precision lead screw, guide rail, equipped with hig h inertia motor to ensure high precision and high stability.

    Efficient autofocus, image recognition, and knife mark inspection make the dicing operation easier.
    Avariety of dicing modes are available, and customized software is provided according to customer material characteristics.

    Optional NCS module,BBD module,remote control module.
    Humanized controlinterface, monitor machine status and production at any time.

  • Ф12 Inch semi-automatic Precision Dicing Saw
    A high-precision,high-performance 12-inch semi-automatic precision dicing saw...

    • A high-precision,high-performance12-inch semi-automatic precision dicing saw,equipped with 2.4kW high-power DC spindle,high-rigidity gantry structure,linear motor + grating fullclosed-loop system,with high precision and high-speed,software independent design,high degree of automation,can meet customers various processing needs,can provide customers with high efficiency, high quality, cost-effective cutting overallsolution.

    Product Characteristics

    X/Y axis equipped with linear motor + grating closed-loop controlsystem, high-precision positioning.

    Efficient autofocus, image re cognition, and knife mark inspection make the dicing operation easier.

    A variety of dicing modes are avalable, and customized software is provided according to customer material characteristics.

    Humanized control interface, monitor machine status and production at any time.

    Compatible with domestic spindles and imported spindles, optional high-power high-torque spindles.

    Optional NCS module. BBD module.

  • ф12 Inch Biaxial semi-automatic Dicing Saw
    A high-precision,high-performance12-inch dual-axis semi-automaticprecision dicing saw...

    • A high-precision,high-performance12-inch dual-axis semi-automatic precision dicing saw, with 2.4kW high-power Dc spindle in the direction,compact structure,small footprint,suitable for large package substrate materials dicing,software independent design, high degree of automation,can meet customers various processing needs,can provide customers with high efficiency, hig hquality, cost-effective cutting overall solution.

    Product Characteristics

    X/Y axis equipped with linear motor + grating closed-loop control system, high-precision positioning.

    Efficient autofocus, image recognition, and knife mark inspection make the dicing operation easier.

    Automatic loading and unloading, automatic dicing, no manual intervention.

    A variety of dicing modes are available, and customized software is provided according to customer material characteristics.

    Optional NCS module, BBD module,remote control module.

    Humanized control interface, monitor machine status and production at any time.

    Opposite type double spindle structure, compact structure, high power and high torque spindle.

  • Ф12 Inch Dual-axis Automatic Wafer Dicing saw
    A 12-inch dual-axis fully automatic wafer dicing saw...

    • A 12-inch dual-axis fully automatic wafer dicing saw that automates wafer loading,alignment,cutting,cleaning,degluing and unloading.Equipped with high-power opposite type imported dual spindle,software independent design,high degree of automation,can meet customer's various processing needs,can provide customers with high efficiency, high quality, cost-effective cutting overall solution.

    Product Characteristics

    Fully automated wafer loading, alignment, dicing, cleaning, degluing and degluing.Equipped with high-precision and high-stability motion platform.

    Equipped with high rigidity linear motor motion platform.

    Equipped with high power opposite dual spindle.

    Standard NCS module and knife mark detection module.

    The workpiece shape detection function is standard.

    Standard data scanning input function.

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
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