ECHINT stands as a distinguished provider in the integrated circuit (IC) industry, specializing in advanced panel level packaging and testing services.
Located in Chengdu China, ECHINT is a dynamic enterprise incubated by the Beijing ESWIN Technology Group. Our core expertise lies in advanced IC packaging and testing, offering a diverse range of services encompassing packaging design, panel level packaging, and testing. Our solutions are widely applied in various sectors including mobiles, 5G, IoT, AI, high-performance computing, and automotive electronics.
Possessing our advanced Panel Level Packaging Fab, ECHINT is forging ahead to establishing an industry-leading intelligent manufacturing base, leveraging high-standard facilities and cutting-edge equipment.
Fuelled by relentless R&D efforts, ECHINT's global experts continuously drive advancements in panel-level packaging technology with expertise spans integrations on 2D FO, 2.xD FO, FO PoP, FCPLP, and other cutting-edge systems. Engaging in active collaboration with supply chain partners during product development, ECHINT delivers high-quality, bespoke packaging solutions globally, pushing the boundaries in the pursuit of innovative packaging technology.