Leading Supplier of Post Die and Wire Bond AOI
Overview
Component Technology Private Limited, incorporated in Singapore on 11 November 1989.
Through continuous innovation with customers’ requirement as our focus, we aim for breakthrough innovation.
We have built good relationships with global leading automotive electronics and high-end semiconductor IDMs and OSATs.
Leveraging on technology, quality, cost, service and delivery we have achieved customer satisfaction.
Our vision solutions include wafer inspection, leadframe measurement and inspection, die and wire bond inspection, moulded package inspection and x-ray image analyser.