Autowell Technology Co.,Ltd

Wuxi,  Jiangsu 
China
http://www.wxautowell.com
  • Booth: 4147

Overview

Founded in 2010, Wuxi Autowell Technology Co., Ltd. (Stock Code: 688516) is a well-known intelligent equipment manufacturer in the PV, Li-ion battery and semiconductor industries, and currently has more than 4000 employees. In the future, ATW will focus on providing comprehensive and smart solutions for the whole industrial chain, helping customers to earn more profits, and making greater contributions to the industry.

It has several subsidiaries nowadays, such as Autowell Intelligent Equipment, SCEC, ATW Xuri, ATW Coshin,Leddo.Its expanding portfolio can now serve the four major sectors of PV industry chain: Rod, Wafer,Cell and Module.The competitive flagship products MBB Cell Stringer and Wafer Inspection System are well recognized by the leading enterprises in PV industry and have gained a large market share. The intelligent Lithium-ion Battery Module/PACK Production Line and Lithium-ion Battery Appearance Inspection Machine, developed independently by ATW, have already obtained repeat orders from several well-known enterprises; and our self-developed product Wire Bonder was officially launched onto the market and already got orders from customer in 2021.

  Products

  • Dicing Saw
    -Blade Breakage Detector (BBD) -Non-contact Setup (NCS) -Highly accurate channel depth inspection -Optional Chip scale package (CSP) -Optional data scanning and recording functions...

    • Mainly designed for the fully automatic dicing process in various fields such as semiconductor wafers, integrated circuits, QFN, DFN and optical communication devices; ideal for a variety of materials such as silicon wafers, lithium niobate, ceramics, glass, quartz, aluminum oxide and PCBs.
  • Soft Solder Die Bonder
    Mainly designed for the die bonding of semiconductor power devices and ideal for power devices and PV modules, such as TO series, DPAK series, PDFN series and DFT modules....

    • -Suitable for multiple loading modes.
    -Equipped with Poka-yoke function before loading.
    -Support dual-head tin writing, and single-head tin writing and spanking.
    -Compatible with different Wafer Mapping formats.
    -Support SECS/GEM communication protocols.
    -Fully automatic wafer load/unload (optional).
  • Aluminum Wedge Bonder
    Mainly designed for the wedge bonding of semiconductor power devices; support thick Al wire and Power ribbon applications E.g. TO252/TO220/TO247/PDFN...

    • -Fully automatic loading and unloading
    -Pull test & ALC inspection methods
    -BPM inline monitoring
    -Low-resistance wire feed detection
  • AOI Machine
    Mainly applied to the appearance inspection of semiconductor discrete devices, integrated circuits and LEDs, and makes it possible to measure the dimensions of die, wire, Power ribbon , Clip, bond and detect their defects....

    • -Fully automatic magazine loading and unloading (programmable)
    -Equipped with 2D+3D cameras
    -Auto workholder adjustment
    -Support several processing methods for NG products (laser marking, inkjet, E-Mapping)
    -Leadframe QR code scanner (optional)

Categories

200 Equipment, Assembly
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Wire Bonding Equipment
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