WTP Series is a high-performance thermal interface material, which is highly flexible and has high thermal conductivity in the vertical (z-plane) direction. This TIM material is generally using polymeric resin with different options of filler, including vertically oriented carbon fiber, graphene, CNT, boron nitrate, etc. HTP series is highly flexible with good compression ratio to allow better compliance to unevenness of any surfaces. It can also be customized into different shapes and sizes based on the requirements of the application.