Welcome to PacTech/Nagase Booth
Overview
PacTech is a technology-focused company specialized in advanced packaging equipment manufacturing and wafer level packaging services. PacTech has been working relentlessly on developing new leading-edge technologies for the next generation applications. Our team of technical experts is striving to resolve various packaging challenges faced by the industry to provide our customers and partners more competitive solutions in terms of cost, time-to-market, and technology advancement.
PacTech's Business Units:
- Advanced Packaging Equipment: Our advanced packaging equipment portfolio incorporates several core technologies including laser soldering (SB2) and wire soldering, laser assisted bonding (LAPALCE) and innovative wafer level bumping solutions such as electroless plating (PacLine) and wafer level ball placement (Ultra-SB2).
- Wafer Level Packaging Service: With our state-of-the-art wafer level bumping, metallization, and advanced packaging processes PacTech supports the heterogeneous integration technology roadmap. In combination with our unique laser soldering and laser bonding equipment, PacTech is able to offer a variety of manufacturing and engineering solutions for the technical and economic challenges in today’s industry.
- Chemicals: As a turnkey solution provider for electroless plating, we are supplying complete process solutions to our customers by combining our plating know-how, equipment and process chemicals to guarantee a successful process transfer.